The effect of sic content on the microstructure and thermal conductivity properties of SiC_p/Cu composites

In order to resolve the weaker wettability between the copper and SiC particles and analyze the micro-structure and thermal conductivity properties of the SiCp/Cu composites, the chemical plating technology and pressure-less sintering technique were utilized to fabricate SiCp/Cu composites. The results proved that SiC powders were more homogeneous in the SiCp/Cu composites and interfaces were clear. The coefficients of linear expansion of SiCp/Cu composites were nonlinear increased along with the measuring temperature increasing. When SiC content was constant, the coefficients of thermal expansion (CTE) and thermal conductivity (TCT) of the SiCp/Cu composites would reduce as the content of the SiC powder became higher.