@inproceedings{153989c453ec47829b29f802e4918a27,
title = "The effect of electroless plating time on the coating performance of SiC powders",
abstract = "In order to improve the interface bonding condition between Cu and SiC powders, electroless copper plating was applied to deposit a Cu coating on SiC powder. The surface morphology of the SiC powder with uncoated and coated copper were investigated. The results showed that the appropriate electroless plating time was necessary for the SiCp with uniform copper-coating. The SiCp/Cu composites were fabricated by hot-press sintering technology. The coated-copper SiCp were uniformly distributed in copper matrix.",
keywords = "Electroless plating, Metal coating",
author = "Ming Hu and Zhang, \{Yun Long\} and Jing Gao and Lin Shan and Tang, \{Li Li\}",
year = "2014",
doi = "10.4028/www.scientific.net/AMR.971-973.204",
language = "英语",
isbn = "9783038351412",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications Ltd",
pages = "204--207",
booktitle = "New Technologies for Engineering Research and Design in Industry",
address = "瑞士",
note = "2014 International Conference on Mechatronics and Intelligent Materials, MIM 2014 ; Conference date: 18-05-2014 Through 19-05-2014",
}