@inproceedings{e98491bcd84d4c9296e8e59659e9b7f7,
title = "The dissolution mechanism of copper weld brazing with Cu-based brazing alloys",
abstract = "In this paper, the dissolution mechanism of copper weld brazing has been researched. The thickness losses of Cu foil in contact with molten Cu-P and Cu-Ag binary alloys at different temperatures have been studied. And the dissolution rate constants in both alloys is calculated and exists following relation: kCu-P (T)=10kCu-Ag (T), which explains the special phenomenon that the dissolving amount of copper in Cu-P liquid alloys is larger than that in Cu-Ag liquid alloys by using weld brazing technology. The dissolution rate of copper in filler metals is the main reason to realize weld brazing. It can be concluded that element P is indispensable in filler metals as the function of accelerating dissolution during weld brazing.",
keywords = "Dissolution rate constant, Dissolving ability of Ag and P, Temperature, Weld brazing",
author = "Li, \{Y. N.\} and Peng, \{Z. L.\} and Yan, \{J. C.\}",
year = "2012",
doi = "10.4028/www.scientific.net/MSF.697-698.394",
language = "英语",
isbn = "9783037852378",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "394--398",
editor = "Tian Huang and Dawei Zhang and Bin Lin and Yanling Tian and Weiguo Gao and Anping Xu",
booktitle = "Advances in Materials Manufacturing Science and Technology XIV",
address = "瑞士",
note = "14th International Manufacturing Conference in China, IMCC2011 ; Conference date: 13-10-2011 Through 15-10-2011",
}