TY - GEN
T1 - The design of tool status intelligent monitoring system for CNC machine
AU - Qin, Zezheng
AU - Wang, Xiaodong
AU - Li, Jiangang
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/8
Y1 - 2018/8
N2 - Based on the background of more and more repeated machining of single workpieces, this paper proposes an intelligent tool condition monitoring system. The vibration acceleration and current signals of the main shaft are collected, and the signal data is analyzed by wavelet packet decomposition and reconstruction and time domain and frequency domain to obtain characteristic values related to the tool state. The feature values extracted from the signal are then processed using normalization and PCA to obtain low-dimensional samples for representing the overall feature information for subsequent determination. Finally, C-SVM pattern recognition is used to implement tool condition monitoring.
AB - Based on the background of more and more repeated machining of single workpieces, this paper proposes an intelligent tool condition monitoring system. The vibration acceleration and current signals of the main shaft are collected, and the signal data is analyzed by wavelet packet decomposition and reconstruction and time domain and frequency domain to obtain characteristic values related to the tool state. The feature values extracted from the signal are then processed using normalization and PCA to obtain low-dimensional samples for representing the overall feature information for subsequent determination. Finally, C-SVM pattern recognition is used to implement tool condition monitoring.
KW - Multi-information fusion
KW - SVM
KW - Tool wear
KW - Wavelet packet decomposition and reconstruction
UR - https://www.scopus.com/pages/publications/85072307482
U2 - 10.1109/ICInfA.2018.8812465
DO - 10.1109/ICInfA.2018.8812465
M3 - 会议稿件
AN - SCOPUS:85072307482
T3 - 2018 IEEE International Conference on Information and Automation, ICIA 2018
SP - 19
EP - 25
BT - 2018 IEEE International Conference on Information and Automation, ICIA 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Conference on Information and Automation, ICIA 2018
Y2 - 11 August 2018 through 13 August 2018
ER -