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The Au electrode optimized by the wettability and viscosity of glass for LTCC techonolgy

  • Tingnan Yan*
  • , Jianwei Zhao
  • , Chao Dong
  • , Xiaoxin Chen
  • , Rong Sun
  • , Dawei Wang*
  • *Corresponding author for this work
  • Shenzhen Institute of Advanced Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The reliability of LTCC modules will be increased by enhancing the wire bonding strength and conductivity of electrode. Au electrode performance has been optimized by the viscosity and wettability of different kinds of glass in this paper. Three kinds of glass were synthesized by melt quenching technique. Flow process of glass in Au electrode effect by glass high-temperature viscosity and wettability was studied. When the viscosity and wettability of glass was decreased, the optimized performance of electrode obtained with wire bonding strength was 10.2g and sheet resistivity was 2.5mΩ/sq.

Original languageEnglish
Title of host publication2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665499057
DOIs
StatePublished - 2022
Externally publishedYes
Event23rd International Conference on Electronic Packaging Technology, ICEPT 2022 - Dalian, China
Duration: 10 Aug 202213 Aug 2022

Publication series

Name2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022

Conference

Conference23rd International Conference on Electronic Packaging Technology, ICEPT 2022
Country/TerritoryChina
CityDalian
Period10/08/2213/08/22

Keywords

  • Au paste
  • LTCC
  • glass
  • viscosity

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