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Temperature effect of vapor-phase self-assembled monolayer for anti-sticking layers used in UV-embossing

  • Soochow University
  • Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

An optimizing method of vapor-phase depositing anti-adherence layer in UV-embossing through controlling temperature is proposed to enhance the quality of demolding process. Experimental results show that, under low deposited temperature, the quality of anti-adherence layer is better than that under high temperature. Under low temperature, the contact angle of water, methylene iodide, and formamide is 119°, 101°, and 105°, and surface free energy is 8.5mJ/m2, which is similar to its ideal value. Film thickness is equal to its molecule length. XPS experiments mean that monolayer under low temperature is more orderly than that under high temperature. And crack character of low temperature is also better than that of high temperature.

Original languageEnglish
Title of host publication2013 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2013 - Conference Proceedings
PublisherIEEE Computer Society
Pages353-356
Number of pages4
ISBN (Print)9781479912131
DOIs
StatePublished - 2013
Event2013 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2013 - Suzhou, China
Duration: 26 Aug 201330 Aug 2013

Publication series

Name2013 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2013 - Conference Proceedings

Conference

Conference2013 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2013
Country/TerritoryChina
CitySuzhou
Period26/08/1330/08/13

Keywords

  • UV-embossing
  • anti-sticking
  • s
  • temperature

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