Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method

Yang Wang; Wenxiao Liu; Wei Liu; Peng He; Zhonghua Fan; Xiaorong Wang; Dingkun Yu; Jiayu Guo; Bing Guo; Hangyan Shen

doi:10.1016/j.microrel.2017.07.069

Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method

Yang Wang
, Wenxiao Liu
, Wei Liu
, Peng He
, Zhonghua Fan
, Xiaorong Wang
, Dingkun Yu
, Jiayu Guo
, Bing Guo
, Hangyan Shen^*

^*Corresponding author for this work

China Jiliang University
Harbin Institute of Technology
Hangzhou Huaguang Advanced Welding Materials Co., LTD

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

SnAgCu alloy with low melting point and good soldering property is a good candidate for the Sn/Pb eutectic. In this paper, SnAgCu nanoparticles were synthesized by a chemical reduction method. The particle size and the melting point are controlled by modifying the process parameters, including reaction temperature, surfactant concentration and dropping speed of precursor. The lowest melting onset temperature is observed at 199.1 °C, which is 18 °C lower than that of commercially available SnAgCu solder alloy. The tensile strength of the as-synthesized reaches 34.3 MPa, which reveals a good solderability property.

Original language	English
Pages (from-to)	17-24
Number of pages	8
Journal	Microelectronics Reliability
Volume	78
DOIs	https://doi.org/10.1016/j.microrel.2017.07.069
State	Published - Nov 2017
Externally published	Yes

Keywords

Chemical reduction method
Low melting point
Process parameters
SnAgCu nanoparticles
Solderability property

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10.1016/j.microrel.2017.07.069

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title = "Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method",

abstract = "SnAgCu alloy with low melting point and good soldering property is a good candidate for the Sn/Pb eutectic. In this paper, SnAgCu nanoparticles were synthesized by a chemical reduction method. The particle size and the melting point are controlled by modifying the process parameters, including reaction temperature, surfactant concentration and dropping speed of precursor. The lowest melting onset temperature is observed at 199.1 °C, which is 18 °C lower than that of commercially available SnAgCu solder alloy. The tensile strength of the as-synthesized reaches 34.3 MPa, which reveals a good solderability property.",

keywords = "Chemical reduction method, Low melting point, Process parameters, SnAgCu nanoparticles, Solderability property",

author = "Yang Wang and Wenxiao Liu and Wei Liu and Peng He and Zhonghua Fan and Xiaorong Wang and Dingkun Yu and Jiayu Guo and Bing Guo and Hangyan Shen",

note = "Publisher Copyright: {\textcopyright} 2017 Elsevier Ltd",

year = "2017",

month = nov,

doi = "10.1016/j.microrel.2017.07.069",

language = "英语",

volume = "78",

pages = "17--24",

journal = "Microelectronics Reliability",

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T1 - Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method

AU - Wang, Yang

AU - Liu, Wenxiao

AU - Liu, Wei

AU - He, Peng

AU - Fan, Zhonghua

AU - Wang, Xiaorong

AU - Yu, Dingkun

AU - Guo, Jiayu

AU - Guo, Bing

AU - Shen, Hangyan

PY - 2017/11

Y1 - 2017/11

N2 - SnAgCu alloy with low melting point and good soldering property is a good candidate for the Sn/Pb eutectic. In this paper, SnAgCu nanoparticles were synthesized by a chemical reduction method. The particle size and the melting point are controlled by modifying the process parameters, including reaction temperature, surfactant concentration and dropping speed of precursor. The lowest melting onset temperature is observed at 199.1 °C, which is 18 °C lower than that of commercially available SnAgCu solder alloy. The tensile strength of the as-synthesized reaches 34.3 MPa, which reveals a good solderability property.

AB - SnAgCu alloy with low melting point and good soldering property is a good candidate for the Sn/Pb eutectic. In this paper, SnAgCu nanoparticles were synthesized by a chemical reduction method. The particle size and the melting point are controlled by modifying the process parameters, including reaction temperature, surfactant concentration and dropping speed of precursor. The lowest melting onset temperature is observed at 199.1 °C, which is 18 °C lower than that of commercially available SnAgCu solder alloy. The tensile strength of the as-synthesized reaches 34.3 MPa, which reveals a good solderability property.

KW - Chemical reduction method

KW - Low melting point

KW - Process parameters

KW - SnAgCu nanoparticles

KW - Solderability property

UR - https://www.scopus.com/pages/publications/85032201728

U2 - 10.1016/j.microrel.2017.07.069

DO - 10.1016/j.microrel.2017.07.069

M3 - 文章

AN - SCOPUS:85032201728

SN - 0026-2714

VL - 78

SP - 17

EP - 24

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -

Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method

Abstract

Keywords

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