@inproceedings{eb9f965d480648069c68e220f4c895ce,
title = "Synthesis of Sn-3.5Ag nanoparticles of tiny sizes",
abstract = "Sn-3.5Ag nanosolder in tiny sizes can provide a practical way to solve the high soldering temperature problem of lead-free solder alloy in fine pitch interconnectivity owing to the unique nanosize effect and meantime stand a higher working temperature just as the bulk material after welding. In this paper, a simple approach to synthesis Sn-3.5Ag nanoparticles by chemical reduction at room temperature is reported and sorts of influencing factors in both size and quality aspects, such as injection rate of the precursor solution/reduction solution, drying temperature, types and volume of solvent, are discussed. To prevent the formation of tin oxide, a reliably capping agent, polyvinylpyrrolidone (PVP), was added into liquid reaction mixture under vigorous stirring instead of blowing any protecting gas. The sizes of as-prepared Sn-3.5Ag can achieve several nanometers without oxidized.",
keywords = "Sn-3.5Ag nanoparticles, injection style, polyol method, solvent, temperature",
author = "Zhi Jiang and Su Ding and Yanhong Tian and Chunqing Wang",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",
year = "2014",
month = oct,
day = "13",
doi = "10.1109/ICEPT.2014.6922938",
language = "英语",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1499--1501",
editor = "Keyun Bi and Zhong Tian and Ziqiang Xu",
booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",
address = "美国",
}