Abstract
The maximum bubble pressure method has been used to measure the surface tension of pure antimony and the surface tension and density (dilatometric method) of Sn-3.8 at%Ag eutectic base alloys with 0.03,0.06 and 0.09 molar fraction of antimony at a temperature range from 550 to 1200 K. The linear dependencies of surface tension and density on temperature were observed and they were described by straight-line equations. Moreover, experimental determination of phase diagram and thermodynamic calculations in the Sn-Ag-Sb system were performed and the resulting optimized thermodynamic parameters were used for modeling of the surface tension. In addition, a non-equilibrium solidification process using the Scheil model was simulated and compared with the equilibrium solidification behavior of a Sn-Ag-Sb alloy.
| Original language | English |
|---|---|
| Pages (from-to) | 652-660 |
| Number of pages | 9 |
| Journal | Materials Transactions |
| Volume | 45 |
| Issue number | 3 |
| DOIs | |
| State | Published - Mar 2004 |
| Externally published | Yes |
Keywords
- Calphad
- Lead-free solder
- Microsoldering
- Thermodynamics
Fingerprint
Dive into the research topics of 'Surface tension and density measurements of Sn-Ag-Sb liquid alloys and phase diagram calculations of the Sn-Ag-Sb ternary system'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver