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Surface tension and density measurements of Sn-Ag-Sb liquid alloys and phase diagram calculations of the Sn-Ag-Sb ternary system

  • Zbigniew Moser*
  • , Wladysław Ga̧sior
  • , Janusz Pstruś
  • , Satoru Ishihara
  • , Xing Jun Liu
  • , Ikuo Ohnuma
  • , Ryosuke Kainuma
  • , Kiyohito Ishida
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The maximum bubble pressure method has been used to measure the surface tension of pure antimony and the surface tension and density (dilatometric method) of Sn-3.8 at%Ag eutectic base alloys with 0.03,0.06 and 0.09 molar fraction of antimony at a temperature range from 550 to 1200 K. The linear dependencies of surface tension and density on temperature were observed and they were described by straight-line equations. Moreover, experimental determination of phase diagram and thermodynamic calculations in the Sn-Ag-Sb system were performed and the resulting optimized thermodynamic parameters were used for modeling of the surface tension. In addition, a non-equilibrium solidification process using the Scheil model was simulated and compared with the equilibrium solidification behavior of a Sn-Ag-Sb alloy.

Original languageEnglish
Pages (from-to)652-660
Number of pages9
JournalMaterials Transactions
Volume45
Issue number3
DOIs
StatePublished - Mar 2004
Externally publishedYes

Keywords

  • Calphad
  • Lead-free solder
  • Microsoldering
  • Thermodynamics

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