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Surface residual stress analysis based on the molecular dynamics on micro/nano scale

  • Y. Zhu*
  • , L. Zhou
  • , D. Y. Gao
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Harbin University of Science and Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The molecular dynamics simulation and experimental study of residual stress were carried out on micro/nano scale. The relationship between residual stress and hardness was researched by the simulation for nano-indentation process of single crystal cooper. It was showed that load-displacement curve above reference state when single crystal copper surface exists compressive residual stress,and the existence of tensile residual stress is below reference state. Then the phenomenon was analyzed and gave a reasonable explanation. In addition, the regression analysis of relationship between micro/nano-hardness and residual stress was carried out.

Original languageEnglish
Pages (from-to)325-329
Number of pages5
JournalAdvanced Materials Research
Volume426
DOIs
StatePublished - 2012

Keywords

  • Molecular Dynamics
  • Residual Stress
  • Single Crystal Cooper

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