Surface damage mechanism of monocrystalline silicon during single point diamond grinding

Quanli Zhang; Yucan Fu; Honghua Su; Qingliang Zhao; Suet To

doi:10.1016/j.wear.2017.11.008

Surface damage mechanism of monocrystalline silicon during single point diamond grinding

Quanli Zhang^*
, Yucan Fu
, Honghua Su
, Qingliang Zhao
, Suet To

^*Corresponding author for this work

Nanjing University of Aeronautics and Astronautics
School of Mechatronics Engineering, Harbin Institute of Technology
Hong Kong Polytechnic University

Research output: Contribution to journal › Article › peer-review

40 Scopus citations

Abstract

Surface damage mechanism of single crystalline Si (100) under single point diamond grinding was investigated in the present study. The result, for the first time, showed that the ductile and brittle material removal appeared at different grinding positions of the diamond wheel due to the varied kinematics of the diamond grits in the cylindrical face and end face. Under the dynamic pressure of the diamond grits, amorphization and the transformation to high pressure phases (Si-III and Si-XI) of Si occurred, which were identified by both XRD and Raman spectroscopy. In addition, surface oxidation and chemical reaction between the Si, O, C and N atoms was analyzed by the XPS, and the new products of Si₃N₄ and graphite oxide (GO) are firstly proposed to be the surface damage of Si and the tool wear mechanism during the ultra-precision machining process.

Original language	English
Pages (from-to)	48-55
Number of pages	8
Journal	Wear
Volume	396-397
DOIs	https://doi.org/10.1016/j.wear.2017.11.008
State	Published - 15 Feb 2018
Externally published	Yes

Keywords

Monocrystalline Si
Phase transformation
Single point diamond grinding
Tribochemistry

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10.1016/j.wear.2017.11.008

Cite this

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title = "Surface damage mechanism of monocrystalline silicon during single point diamond grinding",

abstract = "Surface damage mechanism of single crystalline Si (100) under single point diamond grinding was investigated in the present study. The result, for the first time, showed that the ductile and brittle material removal appeared at different grinding positions of the diamond wheel due to the varied kinematics of the diamond grits in the cylindrical face and end face. Under the dynamic pressure of the diamond grits, amorphization and the transformation to high pressure phases (Si-III and Si-XI) of Si occurred, which were identified by both XRD and Raman spectroscopy. In addition, surface oxidation and chemical reaction between the Si, O, C and N atoms was analyzed by the XPS, and the new products of Si3N4 and graphite oxide (GO) are firstly proposed to be the surface damage of Si and the tool wear mechanism during the ultra-precision machining process.",

keywords = "Monocrystalline Si, Phase transformation, Single point diamond grinding, Tribochemistry",

author = "Quanli Zhang and Yucan Fu and Honghua Su and Qingliang Zhao and Suet To",

note = "Publisher Copyright: {\textcopyright} 2017 Elsevier B.V.",

year = "2018",

month = feb,

day = "15",

doi = "10.1016/j.wear.2017.11.008",

language = "英语",

volume = "396-397",

pages = "48--55",

journal = "Wear",

issn = "0043-1648",

publisher = "Elsevier B.V.",

}

TY - JOUR

T1 - Surface damage mechanism of monocrystalline silicon during single point diamond grinding

AU - Zhang, Quanli

AU - Fu, Yucan

AU - Su, Honghua

AU - Zhao, Qingliang

AU - To, Suet

PY - 2018/2/15

Y1 - 2018/2/15

N2 - Surface damage mechanism of single crystalline Si (100) under single point diamond grinding was investigated in the present study. The result, for the first time, showed that the ductile and brittle material removal appeared at different grinding positions of the diamond wheel due to the varied kinematics of the diamond grits in the cylindrical face and end face. Under the dynamic pressure of the diamond grits, amorphization and the transformation to high pressure phases (Si-III and Si-XI) of Si occurred, which were identified by both XRD and Raman spectroscopy. In addition, surface oxidation and chemical reaction between the Si, O, C and N atoms was analyzed by the XPS, and the new products of Si3N4 and graphite oxide (GO) are firstly proposed to be the surface damage of Si and the tool wear mechanism during the ultra-precision machining process.

AB - Surface damage mechanism of single crystalline Si (100) under single point diamond grinding was investigated in the present study. The result, for the first time, showed that the ductile and brittle material removal appeared at different grinding positions of the diamond wheel due to the varied kinematics of the diamond grits in the cylindrical face and end face. Under the dynamic pressure of the diamond grits, amorphization and the transformation to high pressure phases (Si-III and Si-XI) of Si occurred, which were identified by both XRD and Raman spectroscopy. In addition, surface oxidation and chemical reaction between the Si, O, C and N atoms was analyzed by the XPS, and the new products of Si3N4 and graphite oxide (GO) are firstly proposed to be the surface damage of Si and the tool wear mechanism during the ultra-precision machining process.

KW - Monocrystalline Si

KW - Phase transformation

KW - Single point diamond grinding

KW - Tribochemistry

UR - https://www.scopus.com/pages/publications/85034834511

U2 - 10.1016/j.wear.2017.11.008

DO - 10.1016/j.wear.2017.11.008

M3 - 文章

AN - SCOPUS:85034834511

SN - 0043-1648

VL - 396-397

SP - 48

EP - 55

JO - Wear

JF - Wear

ER -

Surface damage mechanism of monocrystalline silicon during single point diamond grinding

Abstract

Keywords

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