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Study on the mechanism of brittle-ductile transition for turning KDP crystal with single point diamond

  • Jing He Wang*
  • , Ming Jun Chen
  • , Shen Dong
  • , Long Jiang Zhang
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Machining KDP crystal with an ultra-smooth surface is a key subject in the field of modern ultra-precision machining. The variations in hardness and fracture toughness of different orientations on the (001) plane of KDP crystal are studied by means of Vickers indentation. Through establishing a model of critical cutting depth during the occurrence of brittle-ductile transition of KDP crystal, the mechanism of brittle-ductile transition of KDP crystal is studied. The study shows that the minimum critical turning thickness of brittle-ductile KDP transition appears in orientation [110] with minimum fracture toughness and maximum hardness. The maximum critical turning thickness of brittle-ductile KDP transition appears in orientation [001] with maximum fracture toughness and minimum hardness. The KDP crystal is machined by an ultra-precision machine tool. Experimental results are consistent with theoretical conclusion. An ultra-smooth surface with surface roughness of 7.5 nm (RMS) is machined in orientation [001].

Original languageEnglish
Pages (from-to)67-70+88
JournalGuangdian Gongcheng/Opto-Electronic Engineering
Volume32
Issue number7
StatePublished - Jul 2005

Keywords

  • Diamond cutting
  • Fracture toughness
  • KDP crystal
  • Ultra-precision manufacture

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