Study on the Low Temperature Reliability of Leaded Solder

Xiuli Wang; Xiaojian Liu; Ying DIng; Chunjin Hang; Guangdong Wu; Wei Liu; Jiyou Li

doi:10.1109/ICEPT50128.2020.9202516

Study on the Low Temperature Reliability of Leaded Solder

Xiuli Wang
, Xiaojian Liu
, Ying DIng
, Chunjin Hang
, Guangdong Wu
, Wei Liu
, Jiyou Li

CAS - Beijing Institute of Control Engineering
Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

This paper studied the low temperature tensile mechanical properties of Sn63Pb37, Sn62Pb36Ag2, In50Pb50, and Pb88Sn10Ag2 solders. It found that Sn62Pb36Ag2 solder still maintained a high post-break elongation at -150 °C compared with Sn63Pb37, and its low-temperature mechanical properties were more excellent. The dispersed ß-Sn phase in the solder played a key role in strengthening the toughness. Compared with In50Pb50 and Pb88Sn10Ag2, It also showed better process applicability and maturity.

Original language	English
Title of host publication	2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728168265
DOIs	https://doi.org/10.1109/ICEPT50128.2020.9202516
State	Published - Aug 2020
Externally published	Yes
Event	21st International Conference on Electronic Packaging Technology, ICEPT 2020 - Guangzhou, China Duration: 12 Aug 2020 → 15 Aug 2020

Publication series

Name	2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020

Conference

Conference	21st International Conference on Electronic Packaging Technology, ICEPT 2020
Country/Territory	China
City	Guangzhou
Period	12/08/20 → 15/08/20

Keywords

electronic packaging
lead solder
low temperature tensile
reliability

Access to Document

10.1109/ICEPT50128.2020.9202516

Cite this

Wang, X., Liu, X., DIng, Y., Hang, C., Wu, G., Liu, W., & Li, J. (2020). Study on the Low Temperature Reliability of Leaded Solder. In 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020 Article 9202516 (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT50128.2020.9202516

@inproceedings{17deb947f68c4329ab40ed28ac2faf2b,

title = "Study on the Low Temperature Reliability of Leaded Solder",

abstract = "This paper studied the low temperature tensile mechanical properties of Sn63Pb37, Sn62Pb36Ag2, In50Pb50, and Pb88Sn10Ag2 solders. It found that Sn62Pb36Ag2 solder still maintained a high post-break elongation at -150 °C compared with Sn63Pb37, and its low-temperature mechanical properties were more excellent. The dispersed {\ss}-Sn phase in the solder played a key role in strengthening the toughness. Compared with In50Pb50 and Pb88Sn10Ag2, It also showed better process applicability and maturity.",

keywords = "electronic packaging, lead solder, low temperature tensile, reliability",

author = "Xiuli Wang and Xiaojian Liu and Ying DIng and Chunjin Hang and Guangdong Wu and Wei Liu and Jiyou Li",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 21st International Conference on Electronic Packaging Technology, ICEPT 2020 ; Conference date: 12-08-2020 Through 15-08-2020",

year = "2020",

month = aug,

doi = "10.1109/ICEPT50128.2020.9202516",

language = "英语",

series = "2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020",

address = "美国",

}

Wang, X, Liu, X, DIng, Y, Hang, C, Wu, G, Liu, W & Li, J 2020, Study on the Low Temperature Reliability of Leaded Solder. in 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020., 9202516, 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020, Institute of Electrical and Electronics Engineers Inc., 21st International Conference on Electronic Packaging Technology, ICEPT 2020, Guangzhou, China, 12/08/20. https://doi.org/10.1109/ICEPT50128.2020.9202516

Study on the Low Temperature Reliability of Leaded Solder. / Wang, Xiuli; Liu, Xiaojian; DIng, Ying et al.
2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9202516 (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Study on the Low Temperature Reliability of Leaded Solder

AU - Wang, Xiuli

AU - Liu, Xiaojian

AU - DIng, Ying

AU - Hang, Chunjin

AU - Wu, Guangdong

AU - Liu, Wei

AU - Li, Jiyou

PY - 2020/8

Y1 - 2020/8

N2 - This paper studied the low temperature tensile mechanical properties of Sn63Pb37, Sn62Pb36Ag2, In50Pb50, and Pb88Sn10Ag2 solders. It found that Sn62Pb36Ag2 solder still maintained a high post-break elongation at -150 °C compared with Sn63Pb37, and its low-temperature mechanical properties were more excellent. The dispersed ß-Sn phase in the solder played a key role in strengthening the toughness. Compared with In50Pb50 and Pb88Sn10Ag2, It also showed better process applicability and maturity.

AB - This paper studied the low temperature tensile mechanical properties of Sn63Pb37, Sn62Pb36Ag2, In50Pb50, and Pb88Sn10Ag2 solders. It found that Sn62Pb36Ag2 solder still maintained a high post-break elongation at -150 °C compared with Sn63Pb37, and its low-temperature mechanical properties were more excellent. The dispersed ß-Sn phase in the solder played a key role in strengthening the toughness. Compared with In50Pb50 and Pb88Sn10Ag2, It also showed better process applicability and maturity.

KW - electronic packaging

KW - lead solder

KW - low temperature tensile

KW - reliability

UR - https://www.scopus.com/pages/publications/85093363207

U2 - 10.1109/ICEPT50128.2020.9202516

DO - 10.1109/ICEPT50128.2020.9202516

M3 - 会议稿件

AN - SCOPUS:85093363207

T3 - 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020

BT - 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 21st International Conference on Electronic Packaging Technology, ICEPT 2020

Y2 - 12 August 2020 through 15 August 2020

ER -

Wang X, Liu X, DIng Y, Hang C, Wu G, Liu W et al. Study on the Low Temperature Reliability of Leaded Solder. In 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9202516. (2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020). doi: 10.1109/ICEPT50128.2020.9202516

Study on the Low Temperature Reliability of Leaded Solder

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