TY - GEN
T1 - Study on Sub-Millimeter Defect Detection Method Based On High-Frequency Ultrasound
AU - Luo, Huiyu
AU - Jin, Xiaodi
AU - Ding, Jian
AU - Jiang, Di
AU - Zhao, Bo
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - During the electronic packaging process, material inhomogeneity and stress concentration can lead to the generation of sub-millimeter defects, which have a significant impact on product reliability. Traditional non-destructive testing (NDT) techniques, such as X-ray imaging, are difficult to achieve efficient and high-precision defect characterization. To overcome these limitations, a 50 MHz high-frequency ultrasonic microscopic imaging system is designed and built based on C-scan mode, and the performance of this platform through experiments is verified. The experimental results show that under the current conditions, the minimum defect size that this system can resolve is 200 μm, and it can achieve the visualization of sub-millimeter defects. The platform has a sampling frequency of 500 MHz and a maximum scanning speed of 1000 mm/s. This indicates the potential of the platform in high-resolution quality inspection in the field of microelectronic packaging.
AB - During the electronic packaging process, material inhomogeneity and stress concentration can lead to the generation of sub-millimeter defects, which have a significant impact on product reliability. Traditional non-destructive testing (NDT) techniques, such as X-ray imaging, are difficult to achieve efficient and high-precision defect characterization. To overcome these limitations, a 50 MHz high-frequency ultrasonic microscopic imaging system is designed and built based on C-scan mode, and the performance of this platform through experiments is verified. The experimental results show that under the current conditions, the minimum defect size that this system can resolve is 200 μm, and it can achieve the visualization of sub-millimeter defects. The platform has a sampling frequency of 500 MHz and a maximum scanning speed of 1000 mm/s. This indicates the potential of the platform in high-resolution quality inspection in the field of microelectronic packaging.
KW - High-frequency ultrasonic
KW - Non-destructive test
KW - Semiconductor
KW - Ultrasonic micro imaging
UR - https://www.scopus.com/pages/publications/105021989611
U2 - 10.1109/SPAWDA68082.2025.11203331
DO - 10.1109/SPAWDA68082.2025.11203331
M3 - 会议稿件
AN - SCOPUS:105021989611
T3 - Proceedings of the 2025 19th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications, SPAWDA 2025
SP - 24
EP - 28
BT - Proceedings of the 2025 19th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications, SPAWDA 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th National Symposium on Piezoelectricity, Acoustic Waves, and Device Applications, SPAWDA 2025
Y2 - 21 July 2025 through 24 July 2025
ER -