Study on soldering flux used for Sn-0.7Cu welding wire

Cuiping Wang; Jian Wang; Liang Chen; Yuechan Li; Xingjun Liu

doi:10.1109/ISAPM.2011.6105709

Study on soldering flux used for Sn-0.7Cu welding wire

Cuiping Wang^*
, Jian Wang
, Liang Chen
, Yuechan Li
, Xingjun Liu

^*Corresponding author for this work

Xiamen University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The wettability and corrosiveness of some organic acids were tested to choose an appropriate activator. Then orthogonal design method was used to determine the proportion among the components of the activator. At last a certain amount of water-white rosin was added to further optimize the dispensation. The final soldering flux for Sn-0.7Cu welding wire caters to the demands of welding process such as good weld ability, good liquidity, less smoke, full and shiny welding spot.

Original language	English
Title of host publication	APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
Pages	246-249
Number of pages	4
DOIs	https://doi.org/10.1109/ISAPM.2011.6105709
State	Published - 2011
Externally published	Yes
Event	2011 International Symposium on Advanced Packaging Materials, APM 2011 - Xiamen, China Duration: 25 Oct 2011 → 28 Oct 2011

Publication series

Name	Proceedings - International Symposium on Advanced Packaging Materials
ISSN (Print)	1550-5723

Conference

Conference	2011 International Symposium on Advanced Packaging Materials, APM 2011
Country/Territory	China
City	Xiamen
Period	25/10/11 → 28/10/11

Access to Document

10.1109/ISAPM.2011.6105709

Cite this

@inproceedings{98245fe862744b738365e8c5ad1acd7f,

title = "Study on soldering flux used for Sn-0.7Cu welding wire",

abstract = "The wettability and corrosiveness of some organic acids were tested to choose an appropriate activator. Then orthogonal design method was used to determine the proportion among the components of the activator. At last a certain amount of water-white rosin was added to further optimize the dispensation. The final soldering flux for Sn-0.7Cu welding wire caters to the demands of welding process such as good weld ability, good liquidity, less smoke, full and shiny welding spot.",

author = "Cuiping Wang and Jian Wang and Liang Chen and Yuechan Li and Xingjun Liu",

year = "2011",

doi = "10.1109/ISAPM.2011.6105709",

language = "英语",

isbn = "9781467301473",

series = "Proceedings - International Symposium on Advanced Packaging Materials",

pages = "246--249",

booktitle = "APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials",

note = "2011 International Symposium on Advanced Packaging Materials, APM 2011 ; Conference date: 25-10-2011 Through 28-10-2011",

}

Wang, C, Wang, J, Chen, L, Li, Y & Liu, X 2011, Study on soldering flux used for Sn-0.7Cu welding wire. in APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials., 6105709, Proceedings - International Symposium on Advanced Packaging Materials, pp. 246-249, 2011 International Symposium on Advanced Packaging Materials, APM 2011, Xiamen, China, 25/10/11. https://doi.org/10.1109/ISAPM.2011.6105709

Study on soldering flux used for Sn-0.7Cu welding wire. / Wang, Cuiping; Wang, Jian; Chen, Liang et al.
APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials. 2011. p. 246-249 6105709 (Proceedings - International Symposium on Advanced Packaging Materials).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Li, Yuechan

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Y1 - 2011

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AB - The wettability and corrosiveness of some organic acids were tested to choose an appropriate activator. Then orthogonal design method was used to determine the proportion among the components of the activator. At last a certain amount of water-white rosin was added to further optimize the dispensation. The final soldering flux for Sn-0.7Cu welding wire caters to the demands of welding process such as good weld ability, good liquidity, less smoke, full and shiny welding spot.

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SN - 9781467301473

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T2 - 2011 International Symposium on Advanced Packaging Materials, APM 2011

Y2 - 25 October 2011 through 28 October 2011

ER -

Study on soldering flux used for Sn-0.7Cu welding wire

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