Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications

Gao Hui Wu; Zi Yang Xiu; Dong Li Sun; Qiang Zhang; Mei Hui Song

Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications

Gao Hui Wu^*
, Zi Yang Xiu
, Dong Li Sun
, Qiang Zhang
, Mei Hui Song

^*Corresponding author for this work

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

A reclaimed environmental-friendly Sip/LD11 (Al-12%Si) composite with volume fraction of 65% was fabricated by squeeze casting technology. The thermo-physical and mechanical properties of Sip/Al composite for electronic packaging application were studied by use of TEM observation, thermal expansion analyzer, laser thermal conduction analyzer and tensile test machine. The results show that the composite was free of porosity and the Si particles distributed uniformly. The coefficient thermal expansion of composite reached 8.1 × 10^-6/°C, from 20°C to 50°C and increased with the temperature, also reduced after annealing. The thermal conductivity of casting and annealing treatment were 132.9 W/m·°C and 160.1 W/m·°C, respectively. The flexural strength and specific modulus were moderately high. An electroless nickel surface was established on the composite. It is an excellent composite for electronic packaging application.

Original language	English
Pages (from-to)	244-246+250
Journal	Cailiao Kexue yu Gongyi/Material Science and Technology
Volume	14
Issue number	3
State	Published - Jun 2006
Externally published	Yes

Keywords

Aluminum matrix composites
Electronic packaging
Si
Thermal conductivity
Thermal expansion

Cite this

@article{6fab54c9e38e42fbb5238e35bda3aa06,

title = "Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications",

abstract = "A reclaimed environmental-friendly Sip/LD11 (Al-12\%Si) composite with volume fraction of 65\% was fabricated by squeeze casting technology. The thermo-physical and mechanical properties of Sip/Al composite for electronic packaging application were studied by use of TEM observation, thermal expansion analyzer, laser thermal conduction analyzer and tensile test machine. The results show that the composite was free of porosity and the Si particles distributed uniformly. The coefficient thermal expansion of composite reached 8.1 × 10-6/°C, from 20°C to 50°C and increased with the temperature, also reduced after annealing. The thermal conductivity of casting and annealing treatment were 132.9 W/m·°C and 160.1 W/m·°C, respectively. The flexural strength and specific modulus were moderately high. An electroless nickel surface was established on the composite. It is an excellent composite for electronic packaging application.",

keywords = "Aluminum matrix composites, Electronic packaging, Si, Thermal conductivity, Thermal expansion",

author = "Wu, \{Gao Hui\} and Xiu, \{Zi Yang\} and Sun, \{Dong Li\} and Qiang Zhang and Song, \{Mei Hui\}",

year = "2006",

month = jun,

language = "英语",

volume = "14",

pages = "244--246+250",

journal = "Cailiao Kexue yu Gongyi/Material Science and Technology",

issn = "1005-0299",

publisher = "Harbin Institute of Technology",

number = "3",

}

TY - JOUR

T1 - Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications

AU - Wu, Gao Hui

AU - Xiu, Zi Yang

AU - Sun, Dong Li

AU - Zhang, Qiang

AU - Song, Mei Hui

PY - 2006/6

Y1 - 2006/6

N2 - A reclaimed environmental-friendly Sip/LD11 (Al-12%Si) composite with volume fraction of 65% was fabricated by squeeze casting technology. The thermo-physical and mechanical properties of Sip/Al composite for electronic packaging application were studied by use of TEM observation, thermal expansion analyzer, laser thermal conduction analyzer and tensile test machine. The results show that the composite was free of porosity and the Si particles distributed uniformly. The coefficient thermal expansion of composite reached 8.1 × 10-6/°C, from 20°C to 50°C and increased with the temperature, also reduced after annealing. The thermal conductivity of casting and annealing treatment were 132.9 W/m·°C and 160.1 W/m·°C, respectively. The flexural strength and specific modulus were moderately high. An electroless nickel surface was established on the composite. It is an excellent composite for electronic packaging application.

AB - A reclaimed environmental-friendly Sip/LD11 (Al-12%Si) composite with volume fraction of 65% was fabricated by squeeze casting technology. The thermo-physical and mechanical properties of Sip/Al composite for electronic packaging application were studied by use of TEM observation, thermal expansion analyzer, laser thermal conduction analyzer and tensile test machine. The results show that the composite was free of porosity and the Si particles distributed uniformly. The coefficient thermal expansion of composite reached 8.1 × 10-6/°C, from 20°C to 50°C and increased with the temperature, also reduced after annealing. The thermal conductivity of casting and annealing treatment were 132.9 W/m·°C and 160.1 W/m·°C, respectively. The flexural strength and specific modulus were moderately high. An electroless nickel surface was established on the composite. It is an excellent composite for electronic packaging application.

KW - Aluminum matrix composites

KW - Electronic packaging

KW - Si

KW - Thermal conductivity

KW - Thermal expansion

UR - https://www.scopus.com/pages/publications/33748692561

M3 - 文章

AN - SCOPUS:33748692561

SN - 1005-0299

VL - 14

SP - 244-246+250

JO - Cailiao Kexue yu Gongyi/Material Science and Technology

JF - Cailiao Kexue yu Gongyi/Material Science and Technology

IS - 3

ER -

Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications

Abstract

Keywords

Other files and links

Fingerprint

Cite this