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Study on molecular dynamics simulation of tungsten microelectrode based on single discharge in EDM

  • Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, in order to understand the mechanism of the microelectrode self-sharpening phenomenon in single discharge, molecular dynamics (MD) computer simulation is carried out. From the simulation result we find that during tungsten microelectrode self-sharpening process, single atom removing and bulk atom cluster removing both exist. Electric field force is a key factor for microelectrode shape forming. Heating rate (pulse duration) influences the shape of microelectrode largely, a optimum conditions in pulse duration and discharge current exist for microelectrode self-sharpening depending on the thermal conductivity and diameter of electrode.

Original languageEnglish
Title of host publicationCurrent Development in Abrasive Technology - Proceedings of the 9th International Symposium on Advances in Abrasive Technology, ISAAT 2006
Pages543-548
Number of pages6
StatePublished - 2006
Event9th International Symposium on Advances in Abrasive Technology: Current Development in Abrasive Technology, ISAAT 2006 - Dalian, China
Duration: 26 Sep 200629 Sep 2006

Publication series

NameCurrent Development in Abrasive Technology - Proceedings of the 9th International Symposium on Advances in Abrasive Technology, ISAAT 2006

Conference

Conference9th International Symposium on Advances in Abrasive Technology: Current Development in Abrasive Technology, ISAAT 2006
Country/TerritoryChina
CityDalian
Period26/09/0629/09/06

Keywords

  • EDM
  • Microelectrode
  • Molecular dynamics simulation
  • Single discharge

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