TY - GEN
T1 - Study on anodic bonding process of slender vitreous body
AU - Pan, Mingqiang
AU - Chen, Liguo
AU - Chen, Tao
AU - Wang, Zhenhua
AU - Sun, Lining
PY - 2012
Y1 - 2012
N2 - With the development of MEMS technology, the pressure sensors, one of mature MEMS devices, are expected to better performance. In order to improve sensors performance, supporting vitreous body shape is elongated and thinned. But the variety of the vitreous body shape brings the new difficulties for anodic bonding between the vitreous body and the silicon during the sensors production, and causes that the common bonding process conditions are unavailable and bonding failure rate dramatically increases. Therefore, this article analyzes the bonding process between slender vitreous body and silicon, and researches on the influence of the vitreous body variety on the pressure, temperature and voltage. The results showed that the bonding is the best when the cantilever elastic deformation is less than 0.5mm, interface temperature loaded from the silicon is 415° and the voltage 1200V is loaded from the position near H=2mm.
AB - With the development of MEMS technology, the pressure sensors, one of mature MEMS devices, are expected to better performance. In order to improve sensors performance, supporting vitreous body shape is elongated and thinned. But the variety of the vitreous body shape brings the new difficulties for anodic bonding between the vitreous body and the silicon during the sensors production, and causes that the common bonding process conditions are unavailable and bonding failure rate dramatically increases. Therefore, this article analyzes the bonding process between slender vitreous body and silicon, and researches on the influence of the vitreous body variety on the pressure, temperature and voltage. The results showed that the bonding is the best when the cantilever elastic deformation is less than 0.5mm, interface temperature loaded from the silicon is 415° and the voltage 1200V is loaded from the position near H=2mm.
KW - Anodic bonding
KW - Bonding process
KW - Slender Vitreous body
UR - https://www.scopus.com/pages/publications/84863126433
U2 - 10.4028/www.scientific.net/KEM.503.435
DO - 10.4028/www.scientific.net/KEM.503.435
M3 - 会议稿件
AN - SCOPUS:84863126433
SN - 9783037853641
T3 - Key Engineering Materials
SP - 435
EP - 439
BT - Micro-Nano Technology XIII
PB - Trans Tech Publications Ltd
T2 - 13th Annual Conference of Chinese Society of Micro-Nano Technology, CSMNT 2011
Y2 - 28 September 2011 through 30 September 2011
ER -