Study of the electrochemical deposition of Sn-Ag-Cu alloy by cyclic voltammetry and chronoamperometry

The electrochemical deposition of Sn-Ag-Cu alloy from weakly acidic baths onto glassy carbon electrodes (GCE) was studied by cyclic voltammetry (CV) and chronoamperometry (CA). The properties of the electrodeposits were characterized by scanning electron microscopy (SEM), energy-dispersive spectrometery (EDS) and X-ray diffraction (XRD). Test results indicate that the two cathodic peaks in the CV curves, at -0.6 V and -0.85 V during the forward scan towards the negative potentials, correspond to the irreversible deposition of a solid solution of tin, silver and copper. The underpotential deposition (UPD) of Sn occurs at -0.6 V during the cathodic period and the amount of Ag and Cu in the Sn-Ag-Cu alloy decreases with increasingly negative cathodic potentials. During the forward scan, towards the positive potentials used in CV testing, cathodic peaks at -0.85 V appear in the CV curves for baths containing mixtures of tin salts and triethanolamine (TEA). This corresponds to a reduction of transient complex ions [Sn(TEA)_x]²⁺ on the surface of the cathode. Furthermore, the formation and reduction of [Sn(TEA)_x]²⁺ is a diffusion controlled process. On the surface of the GCE, the actual nucleus growth mechanism of the Sn-Ag-Cu alloy is represented by the progressive nucleation model.