Study of prepress force on piezoelectric transducer of wire bonding

Zhanhui Li; Yunxin Wu; Zhili Long

doi:10.1109/ICEPT.2008.4607107

Study of prepress force on piezoelectric transducer of wire bonding

Zhanhui Li^*
, Yunxin Wu
, Zhili Long

^*Corresponding author for this work

Central South University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

The friction contact model of ultrasonic propagation in wire bonding transducer is established. This paper studied piezoelectric driver structure. The relation of tighten moment and apply voltage is deduced. The wire bonding transducer scopes of tighten moment and apply voltage is educed. It provides foundation for design and operating of wire bonding system.

Original language	English
Title of host publication	Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
DOIs	https://doi.org/10.1109/ICEPT.2008.4607107
State	Published - 2008
Externally published	Yes
Event	2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 - Pudong, Shanghai, China Duration: 28 Jul 2008 → 31 Jul 2008

Publication series

Name	Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Conference

Conference	2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Country/Territory	China
City	Pudong, Shanghai
Period	28/07/08 → 31/07/08

Access to Document

10.1109/ICEPT.2008.4607107

Cite this

Li, Z., Wu, Y., & Long, Z. (2008). Study of prepress force on piezoelectric transducer of wire bonding. In Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 Article 4607107 (Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008). https://doi.org/10.1109/ICEPT.2008.4607107

@inproceedings{e7524913bd924b3a94ce9dd89a6c312a,

title = "Study of prepress force on piezoelectric transducer of wire bonding",

abstract = "The friction contact model of ultrasonic propagation in wire bonding transducer is established. This paper studied piezoelectric driver structure. The relation of tighten moment and apply voltage is deduced. The wire bonding transducer scopes of tighten moment and apply voltage is educed. It provides foundation for design and operating of wire bonding system.",

author = "Zhanhui Li and Yunxin Wu and Zhili Long",

year = "2008",

doi = "10.1109/ICEPT.2008.4607107",

language = "英语",

isbn = "9781424427406",

series = "Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008",

booktitle = "Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008",

note = "2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 ; Conference date: 28-07-2008 Through 31-07-2008",

}

Li, Z, Wu, Y & Long, Z 2008, Study of prepress force on piezoelectric transducer of wire bonding. in Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008., 4607107, Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008, Pudong, Shanghai, China, 28/07/08. https://doi.org/10.1109/ICEPT.2008.4607107

Study of prepress force on piezoelectric transducer of wire bonding. / Li, Zhanhui; Wu, Yunxin; Long, Zhili.
Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008. 2008. 4607107 (Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Study of prepress force on piezoelectric transducer of wire bonding

AU - Li, Zhanhui

AU - Wu, Yunxin

AU - Long, Zhili

PY - 2008

Y1 - 2008

N2 - The friction contact model of ultrasonic propagation in wire bonding transducer is established. This paper studied piezoelectric driver structure. The relation of tighten moment and apply voltage is deduced. The wire bonding transducer scopes of tighten moment and apply voltage is educed. It provides foundation for design and operating of wire bonding system.

AB - The friction contact model of ultrasonic propagation in wire bonding transducer is established. This paper studied piezoelectric driver structure. The relation of tighten moment and apply voltage is deduced. The wire bonding transducer scopes of tighten moment and apply voltage is educed. It provides foundation for design and operating of wire bonding system.

UR - https://www.scopus.com/pages/publications/52449087219

U2 - 10.1109/ICEPT.2008.4607107

DO - 10.1109/ICEPT.2008.4607107

M3 - 会议稿件

AN - SCOPUS:52449087219

SN - 9781424427406

T3 - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Y2 - 28 July 2008 through 31 July 2008

ER -

Li Z, Wu Y, Long Z. Study of prepress force on piezoelectric transducer of wire bonding. In Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008. 2008. 4607107. (Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008). doi: 10.1109/ICEPT.2008.4607107

Study of prepress force on piezoelectric transducer of wire bonding

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