Study of MEMS packaging technology

Yufeng Zhang; Xiaoyun Tan; Weiping Chen; Guowei Zhang; Xiaowei Liu

doi:10.1109/ICEPT.2005.1564712

Study of MEMS packaging technology

Yufeng Zhang^*
, Xiaoyun Tan
, Weiping Chen
, Guowei Zhang
, Xiaowei Liu

^*Corresponding author for this work

School of Astronautics

Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

This paper will describe the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed.

Original language	English
Title of host publication	2005 6th International Conference on Electronics Packaging Technology
DOIs	https://doi.org/10.1109/ICEPT.2005.1564712
State	Published - 2005
Event	2005 6th International Conference on Electronics Packaging Technology - Dameisha, Shenzhen, China Duration: 30 Aug 2005 → 2 Sep 2005

Publication series

Name	2005 6th International Conference on Electronics Packaging Technology
Volume	2005

Conference

Conference	2005 6th International Conference on Electronics Packaging Technology
Country/Territory	China
City	Dameisha, Shenzhen
Period	30/08/05 → 2/09/05

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10.1109/ICEPT.2005.1564712

Cite this

@inproceedings{184e6d0958294f3faa779dbb759d4b4a,

title = "Study of MEMS packaging technology",

abstract = "This paper will describe the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed.",

author = "Yufeng Zhang and Xiaoyun Tan and Weiping Chen and Guowei Zhang and Xiaowei Liu",

year = "2005",

doi = "10.1109/ICEPT.2005.1564712",

language = "英语",

isbn = "0780394496",

series = "2005 6th International Conference on Electronics Packaging Technology",

booktitle = "2005 6th International Conference on Electronics Packaging Technology",

note = "2005 6th International Conference on Electronics Packaging Technology ; Conference date: 30-08-2005 Through 02-09-2005",

}

Zhang, Y, Tan, X, Chen, W, Zhang, G & Liu, X 2005, Study of MEMS packaging technology. in 2005 6th International Conference on Electronics Packaging Technology., 1564712, 2005 6th International Conference on Electronics Packaging Technology, vol. 2005, 2005 6th International Conference on Electronics Packaging Technology, Dameisha, Shenzhen, China, 30/08/05. https://doi.org/10.1109/ICEPT.2005.1564712

TY - GEN

T1 - Study of MEMS packaging technology

AU - Zhang, Yufeng

AU - Tan, Xiaoyun

AU - Chen, Weiping

AU - Zhang, Guowei

AU - Liu, Xiaowei

PY - 2005

Y1 - 2005

N2 - This paper will describe the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed.

AB - This paper will describe the status and effects of packaging in the MEMS devices. It is pointed out that there are several marked characteristics in the MEMS differences with compare with that of IC packaging. Meanwhile it presents several methods and developing trends of MEMS packaging with the particular emphasis on analysis of its applications, including the packaging means and testing results after packaging of microaccelerometers, acoustic-vibration sensors and other MEMS devices. Some useful thoughts are also obtained. Finally the existing problems and the future directions of MEMS packaging technology are discussed.

UR - https://www.scopus.com/pages/publications/33846274558

U2 - 10.1109/ICEPT.2005.1564712

DO - 10.1109/ICEPT.2005.1564712

M3 - 会议稿件

AN - SCOPUS:33846274558

SN - 0780394496

SN - 9780780394490

T3 - 2005 6th International Conference on Electronics Packaging Technology

BT - 2005 6th International Conference on Electronics Packaging Technology

T2 - 2005 6th International Conference on Electronics Packaging Technology

Y2 - 30 August 2005 through 2 September 2005

ER -

Study of MEMS packaging technology

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Conference

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