Skip to main navigation Skip to search Skip to main content

Study of immersion gold plating process on Ni-P substrates

  • Haiping Liu*
  • , Ning Li
  • , Sifu Bi
  • , Deyu Li
  • , Jian Zheng
  • , Kang Li
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The immersion gold process based on Ni-P substrate at different conditions was investigated by mixed potential neasurement and X-ray fluorescence spectrometer (XRF) analysis. The influence mechanism was also discussed. The re-alts show that there is good relativity between the mixed potential and the gold deposition rate. Bath compositions and operating conditions have much effect on mixed potential. These effects could be attributed to the variation of electrode surface state. The optimized conditions for immersion gold plating bath were determined. These results demonstrate that the mixed potential measurement is a useful method of monitoring the immersion gold process.

Original languageEnglish
Pages (from-to)175-179
Number of pages5
JournalJournal of Rare Earths
Volume24
Issue numberSUPPL. 3
DOIs
StatePublished - Dec 2006

Keywords

  • Deposition rate
  • Immersion gold
  • Mixed potential
  • Ni-P substrate
  • XRF

Fingerprint

Dive into the research topics of 'Study of immersion gold plating process on Ni-P substrates'. Together they form a unique fingerprint.

Cite this