Skip to main navigation Skip to search Skip to main content

Study of a crack in a functionally graded layered structure under thermal load

  • Li Cheng Guo*
  • , Naotake Noda
  • *Corresponding author for this work
  • Shizuoka University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, the thermal fracture behavior for a crack perpendicular to the interface in a functionally graded layered structure (FGLS) with a functionally graded interfacial layer is investigated. The plane strain state is considered. During the analytical procedure, integral transform methods are used to obtain the displacement and stress expressions. Then, by introducing an auxiliary function and using the residue theory and the singular integral equation method, the thermal stress intensity factor (TSIF) is calculated. Particularly, a crack intersecting the interface is considered. Some representative structure with different nonhomogeneity material properties and geometric parameters are analyzed and the corresponding TSIF is presented. The influences of the nonhomogeneity constants and the geometry parameters on the TSIFs are analyzed.

Original languageEnglish
Title of host publicationProceedings of the 16th International Conference on Composite Materials, ICCM-16 - "A Giant Step Towards Environmental Awareness
Subtitle of host publicationFrom Green Composites to Aerospace"
PublisherInternational Committee on Composite Materials
ISBN (Print)9784931136052
StatePublished - 2007

Publication series

NameICCM International Conferences on Composite Materials

Keywords

  • Crack
  • Functionally graded layered structure
  • Thermal stress intensity factors (tsifs)

Fingerprint

Dive into the research topics of 'Study of a crack in a functionally graded layered structure under thermal load'. Together they form a unique fingerprint.

Cite this