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Stress intensity factor analysis of a functionally graded piezoelectric strip under anti-plane deformation

  • Li Ma*
  • , Lin Zhi Wu
  • , Wu Nie
  • *Corresponding author for this work
  • Harbin Engineering University
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

By using the Fourier transform and defining the jumps of displacement and electric potential components across the crack surface as unknown functions, two pairs of dual integral equations are derived. To solve the dual integral equations, the jumps of the displacement and electric potential components across the crack surface are expanded in a series of Jacobi polynomials. Numerical examples are provided to show the effects of material properties, loading condition and crack size on the stress and electric displacement intensity factors.

Original languageEnglish
Pages (from-to)47-51
Number of pages5
JournalGongcheng Lixue/Engineering Mechanics
Volume23
Issue number1
StatePublished - Jan 2006

Keywords

  • Electric displacement intensity factor
  • Engineering mechanics
  • Functionally graded piezoelectric materials (FGPM)
  • Integral equation
  • Stress intensity factor

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