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Special modulator for high frequency, low-voltage plasma immersion ion implantation

  • Xiubo Tian
  • , Xiaofeng Wang
  • , Baoyin Tang
  • , Paul K. Chu*
  • , Ping K. Ko
  • , Yiu Chung Cheng
  • *Corresponding author for this work
  • City University of Hong Kong
  • Harbin Institute of Technology
  • Hong Kong University of Science and Technology
  • The University of Hong Kong

Research output: Contribution to journalArticlepeer-review

Abstract

Plasma immersion ion implantation is a burgeoning surface modification technique and not limited by the line-of-sight restriction plaguing conventional beam-line ion implantation. It is therefore an excellent technique to treat interior surfaces as well as components of a complex shape. To enhance the implant uniformity and increase the thickness of the modified layer, we are using a high frequency, low-voltage process to achieve high temperature and dose rate to increase the thickness of the modified layer. The low voltage conditions also lead to a thinner sheath more favorable to conformal implantation. In this article, we will describe our special modulator consisting of a single ended forward converter with a step-up transformer. The modulator is designed to operate from 5 to 35 kHz and the output voltage is adjustable to an upper ceiling of 5000 V that is deliberately chosen to be our voltage limit for the present experiments. We will also present experimental data on SS304 stainless steel materials elucidating the advantages of our modulator and high frequency, low-voltage experimental protocols.

Original languageEnglish
Pages (from-to)1824-1828
Number of pages5
JournalReview of Scientific Instruments
Volume70
Issue number3
DOIs
StatePublished - Mar 1999
Externally publishedYes

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