@inproceedings{2176fec213084c21b04591e67df43e76,
title = "Soldering copper to aluminum with CU-Al2O3composite coatings deposited by cold spraying",
abstract = "During the cold spraying process, the copper particles were tightly deposited on the aluminum substrate with the help of Al2O3. The results reveal that the Cu-Al2O3 composite particles can produce a coating with a thickness of 70-80 μm under particular cold spraying process, proving the feasibility of cold sprayed copper coating for soldering. SAC305 and copper blocks were used for pressureless sintering on the cold sprayed composite copper coating, and the shear strength of the solder joint obtained by reacting at 250 °C for 2 min was 34.9 MPa, and the fracture path was inside the composite coating rather than the coating-substrate interface. The wettability of SAC305 solder paste on cold sprayed copper coating were also analyzed.",
keywords = "Bonding mechanism, Cold spray, CuAlOcoating, Mechanical reliability, Soldering",
author = "Xingchao Mao and Jiahao Liu and Jianqiang Wang and Weiwei Zhang and Xinjie Wang and Fangcheng Duan and Fengyi Wang and Hongtao Chen and Mingyu Li and Ziwen Lv",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 23rd International Conference on Electronic Packaging Technology, ICEPT 2022 ; Conference date: 10-08-2022 Through 13-08-2022",
year = "2022",
doi = "10.1109/ICEPT56209.2022.9873478",
language = "英语",
series = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022",
address = "美国",
}