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Solder bridge mechanism in surface mount technology

  • Mingyu Li*
  • , Chunqing Wang
  • , Lei Zhang
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

In the light of the minimum energy principle, the energy equation for the forming process of a joint is formulated, and the forming process of bridged joints is numerically simulated. On this basis, the mechanism of bridging in surface mount technology (SMT) is investigated.

Original languageEnglish
Pages (from-to)224-225
Number of pages2
JournalProgress in Natural Science: Materials International
Volume11
Issue number3
StatePublished - Mar 2001

Keywords

  • Bridging
  • Formation of a joint
  • Surface mount technology (SMT)

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