Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

Yilong Huang; Ziyang Xiu; Yanhong Tian

doi:10.1109/CSTIC.2016.7463949

Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

Yilong Huang
, Ziyang Xiu
, Yanhong Tian^*

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

A Sn-3.0Ag-0.5Cu (SAC) composite solder was fabricated by adding 0.1% weight percentage of multilayer graphene. The process steps are detailedly introduced in this paper. The physical, thermomechanical, wetting, mechanical properties were tested. Experimental results present that density and coefficient of thermal expansion of plain solder are higher than those of composite solder, while the thermal diffusion coefficient and wettability are improved after adding graphene. Besides, as expected, the addition of graphene has slight influence on melting temperature of SAC solder. Furthermore, the shear strength of solder ball joints was also improved more than 40% by adding graphene.

Original language	English
Title of host publication	China Semiconductor Technology International Conference 2016, CSTIC 2016
Editors	Hanming Wu, Hsiang-Lan Lung, Ying Shi, Dong Chen, David Huang, Qi Wang, Kuochun Wu, Ying Zhang, Cor Claeys, Steve Liang, Ru Huang, Beichao Zhang, Peilin Song, Jiang Yan, Qinghuang Lin, Kafai Lai
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781467388047
DOIs	https://doi.org/10.1109/CSTIC.2016.7463949
State	Published - 2 May 2016
Event	China Semiconductor Technology International Conference, CSTIC 2016 - Shanghai, China Duration: 13 Mar 2016 → 14 Mar 2016

Publication series

Name	China Semiconductor Technology International Conference 2016, CSTIC 2016

Conference

Conference	China Semiconductor Technology International Conference, CSTIC 2016
Country/Territory	China
City	Shanghai
Period	13/03/16 → 14/03/16

Access to Document

10.1109/CSTIC.2016.7463949

Cite this

Huang, Y., Xiu, Z., & Tian, Y. (2016). Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene. In H. Wu, H.-L. Lung, Y. Shi, D. Chen, D. Huang, Q. Wang, K. Wu, Y. Zhang, C. Claeys, S. Liang, R. Huang, B. Zhang, P. Song, J. Yan, Q. Lin, & K. Lai (Eds.), China Semiconductor Technology International Conference 2016, CSTIC 2016 Article 7463949 (China Semiconductor Technology International Conference 2016, CSTIC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CSTIC.2016.7463949

Huang, Yilong ; Xiu, Ziyang ; Tian, Yanhong. / Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene. China Semiconductor Technology International Conference 2016, CSTIC 2016. editor / Hanming Wu ; Hsiang-Lan Lung ; Ying Shi ; Dong Chen ; David Huang ; Qi Wang ; Kuochun Wu ; Ying Zhang ; Cor Claeys ; Steve Liang ; Ru Huang ; Beichao Zhang ; Peilin Song ; Jiang Yan ; Qinghuang Lin ; Kafai Lai. Institute of Electrical and Electronics Engineers Inc., 2016. (China Semiconductor Technology International Conference 2016, CSTIC 2016).

@inproceedings{bad3af613d9d46589523c6d4ecb04d29,

title = "Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene",

abstract = "A Sn-3.0Ag-0.5Cu (SAC) composite solder was fabricated by adding 0.1\% weight percentage of multilayer graphene. The process steps are detailedly introduced in this paper. The physical, thermomechanical, wetting, mechanical properties were tested. Experimental results present that density and coefficient of thermal expansion of plain solder are higher than those of composite solder, while the thermal diffusion coefficient and wettability are improved after adding graphene. Besides, as expected, the addition of graphene has slight influence on melting temperature of SAC solder. Furthermore, the shear strength of solder ball joints was also improved more than 40\% by adding graphene.",

author = "Yilong Huang and Ziyang Xiu and Yanhong Tian",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; China Semiconductor Technology International Conference, CSTIC 2016 ; Conference date: 13-03-2016 Through 14-03-2016",

year = "2016",

month = may,

day = "2",

doi = "10.1109/CSTIC.2016.7463949",

language = "英语",

series = "China Semiconductor Technology International Conference 2016, CSTIC 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

editor = "Hanming Wu and Hsiang-Lan Lung and Ying Shi and Dong Chen and David Huang and Qi Wang and Kuochun Wu and Ying Zhang and Cor Claeys and Steve Liang and Ru Huang and Beichao Zhang and Peilin Song and Jiang Yan and Qinghuang Lin and Kafai Lai",

booktitle = "China Semiconductor Technology International Conference 2016, CSTIC 2016",

address = "美国",

}

Huang, Y, Xiu, Z & Tian, Y 2016, Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene. in H Wu, H-L Lung, Y Shi, D Chen, D Huang, Q Wang, K Wu, Y Zhang, C Claeys, S Liang, R Huang, B Zhang, P Song, J Yan, Q Lin & K Lai (eds), China Semiconductor Technology International Conference 2016, CSTIC 2016., 7463949, China Semiconductor Technology International Conference 2016, CSTIC 2016, Institute of Electrical and Electronics Engineers Inc., China Semiconductor Technology International Conference, CSTIC 2016, Shanghai, China, 13/03/16. https://doi.org/10.1109/CSTIC.2016.7463949

Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene. / Huang, Yilong; Xiu, Ziyang ; Tian, Yanhong.
China Semiconductor Technology International Conference 2016, CSTIC 2016. ed. / Hanming Wu; Hsiang-Lan Lung; Ying Shi; Dong Chen; David Huang; Qi Wang; Kuochun Wu; Ying Zhang; Cor Claeys; Steve Liang; Ru Huang; Beichao Zhang; Peilin Song; Jiang Yan; Qinghuang Lin; Kafai Lai. Institute of Electrical and Electronics Engineers Inc., 2016. 7463949 (China Semiconductor Technology International Conference 2016, CSTIC 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

AU - Huang, Yilong

AU - Xiu, Ziyang

AU - Tian, Yanhong

PY - 2016/5/2

Y1 - 2016/5/2

N2 - A Sn-3.0Ag-0.5Cu (SAC) composite solder was fabricated by adding 0.1% weight percentage of multilayer graphene. The process steps are detailedly introduced in this paper. The physical, thermomechanical, wetting, mechanical properties were tested. Experimental results present that density and coefficient of thermal expansion of plain solder are higher than those of composite solder, while the thermal diffusion coefficient and wettability are improved after adding graphene. Besides, as expected, the addition of graphene has slight influence on melting temperature of SAC solder. Furthermore, the shear strength of solder ball joints was also improved more than 40% by adding graphene.

AB - A Sn-3.0Ag-0.5Cu (SAC) composite solder was fabricated by adding 0.1% weight percentage of multilayer graphene. The process steps are detailedly introduced in this paper. The physical, thermomechanical, wetting, mechanical properties were tested. Experimental results present that density and coefficient of thermal expansion of plain solder are higher than those of composite solder, while the thermal diffusion coefficient and wettability are improved after adding graphene. Besides, as expected, the addition of graphene has slight influence on melting temperature of SAC solder. Furthermore, the shear strength of solder ball joints was also improved more than 40% by adding graphene.

UR - https://www.scopus.com/pages/publications/84974602806

U2 - 10.1109/CSTIC.2016.7463949

DO - 10.1109/CSTIC.2016.7463949

M3 - 会议稿件

AN - SCOPUS:84974602806

T3 - China Semiconductor Technology International Conference 2016, CSTIC 2016

BT - China Semiconductor Technology International Conference 2016, CSTIC 2016

A2 - Wu, Hanming

A2 - Lung, Hsiang-Lan

A2 - Shi, Ying

A2 - Chen, Dong

A2 - Huang, David

A2 - Wang, Qi

A2 - Wu, Kuochun

A2 - Zhang, Ying

A2 - Claeys, Cor

A2 - Liang, Steve

A2 - Huang, Ru

A2 - Zhang, Beichao

A2 - Song, Peilin

A2 - Yan, Jiang

A2 - Lin, Qinghuang

A2 - Lai, Kafai

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - China Semiconductor Technology International Conference, CSTIC 2016

Y2 - 13 March 2016 through 14 March 2016

ER -

Huang Y, Xiu Z , Tian Y. Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene. In Wu H, Lung HL, Shi Y, Chen D, Huang D, Wang Q, Wu K, Zhang Y, Claeys C, Liang S, Huang R, Zhang B, Song P, Yan J, Lin Q, Lai K, editors, China Semiconductor Technology International Conference 2016, CSTIC 2016. Institute of Electrical and Electronics Engineers Inc. 2016. 7463949. (China Semiconductor Technology International Conference 2016, CSTIC 2016). doi: 10.1109/CSTIC.2016.7463949

Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

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