@inproceedings{644e75ebf6b748aa927e01251f53fe06,
title = "Size effect on deformation and fracture behavior of Sn3.0Ag0.5Cu lead free solder joints",
abstract = "To elaborate deformation and fracture behavior of Sn3.0Ag0.5Cu solder joint, dynamic shear testing was designed and performed on as-reflowed and aged solder joints. Scanning electron Microscopy (SEM) was applied to observe the influences of microstructures and intermetallic compounds (IMCs) on the solder joints fracture behavior. The experimental results suggested the morphology of the solder joints shows size effect. The nano-scale particle-like Ag 3Sn dispersed in the small solder joints and had a strengthening effect on their mechanical property. While the dendritic and feather-like Ag 3Sn occured in the big solder joints and the big solder joints became more brittle. Obvious plastic deformation in company with dynamic recovery and recrystallization was observed in small solder joints during dynamic shear testing. The fracture occurred in the bulk solder. While the brittle fracture occured in big solder joints and the fracture positions were at the areas close to the joining interface. The cracks propogated by the way of transgranular fracture. After aging, dynamic recovery and recrystallization occurred in all the solder joints. While the plasticity of big solder joint was enhanced and the transgranular fracture as well as the intergranular fracture occurred during dynamic shear testing.",
keywords = "Fracture behavior, Intermetallic compounds, Lead free solder joint, Size effect",
author = "Yanhong Tian and Chunjin Hang and Lina Niu and Chunqing Wang",
year = "2011",
language = "英语",
isbn = "9781618392619",
series = "Materials Science and Technology Conference and Exhibition 2011, MS and T'11",
pages = "1518--1525",
booktitle = "Materials Science and Technology Conference and Exhibition 2011, MS and T'11",
note = "Materials Science and Technology Conference and Exhibition 2011, MS and T'11 ; Conference date: 16-10-2011 Through 20-10-2011",
}