Abstract
The dissolution and precipitation behavior of a solid-Al/melted-Sn system was investigated. Total Al content in the Sn bump increased continuously with time and reached 30 at%, far exceeding the solubility limit (3.7 at%) of Al in molten Sn. The reason for over-saturation was analyzed and discussed. A single-directional dynamic equilibrium process demonstrated that a α-Al solid solution can precipitate continuously from melted Sn while Al substrate is dissolved continuously by melted Sn. Ultrasonic action can improve the rate of this effect. This work could facilitate the development of a new method to improve the performance of bonding joints or multicomponent alloys.
| Original language | English |
|---|---|
| Pages (from-to) | 611-613 |
| Number of pages | 3 |
| Journal | Materials Letters |
| Volume | 236 |
| DOIs | |
| State | Published - 1 Feb 2019 |
Keywords
- Aluminum
- Diffusion
- Dynamic equilibrium
- Interfaces
- Tin
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