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Simulation of residual stress and distortion evolution in dual-robot collaborative wire-arc additive manufactured Al-Cu alloys

  • Runsheng Li
  • , Guanpeng Ju
  • , Xushan Zhao
  • , Yanzhen Zhang
  • , Yongzhe Li
  • , Guofang Hu
  • , Mingyu Yan
  • , Yuyao Wu
  • , Danyang Lin*
  • *Corresponding author for this work
  • China University of Petroleum (East China)
  • School of Mechatronics Engineering, Harbin Institute of Technology
  • System Design Institute of Hubei Aerospace Technology Academy
  • Southeast University, Nanjing
  • Harbin Institute of Technology Weihai

Research output: Contribution to journalArticlepeer-review

Abstract

The aim of this study is to evaluate the residual stress and deformation distribution of large thin-walled Al-Cu alloy components produced by a dual-robot collaborative system in wire-arc additive manufacturing. Finite element models of single-robot and dual-robot systems were developed and experimentally validated using infrared thermography and structured light sensors. The dual-robot achieved significantly lower maximum temperature gradients in both deposition (0.47 × 105 ℃/m vs. 0.68 × 105 ℃/m) and height directions (0.94 × 105 ℃/m vs. 1.03 × 105 ℃/m) compared to the single robot, indicating more uniform temperature distribution. The stress evolution process and distribution between the single robot and dual-robot systems differs, but both exhibit approximately symmetric distributions. Moreover, the dual-robot reduced vertical displacement in the substrate by approximately 29% (15.2 vs. 21.4 mm), attributable to more uniform stress distribution and reduced temperature gradients. The additive manufacturing of a commercial aircraft load-bearing frame validated the application potential of this technology in the industry.

Original languageEnglish
Article numbere2409390
JournalVirtual and Physical Prototyping
Volume19
Issue number1
DOIs
StatePublished - 2024
Externally publishedYes

Keywords

  • Wire-based additive manufacturing
  • deformation
  • dual-robot
  • residual stress
  • simulation

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