TY - GEN
T1 - Simulation of a Piezoelectric MEMS Accelerometer using Finite Element Modeling with Freefem++
AU - Ma, Guoming
AU - Zhou, Peng
AU - Zhang, Hao
AU - Qian, Jinxin
AU - Zhen, Yubao
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/8
Y1 - 2020/8
N2 - In this paper, a two-dimensional finite element model of a piezoelectric MEMS accelerometer is developed and analyzed using FreeFem++. First, a steady state equation of the thermal conduction is solved to obtain the temperature field. Then the quasi-stationary Cauchy-Navier's equations with thermal stresses present are solved to determine the distribution of the total stresses. As a result, the electric displacement along the vertical direction of the PZT piezoelectric layer is calculated using the constitutive equation of the piezoelectric material. Finally, the total output electric charge on the two top electrodes are determined. The influences of thicknesses of the silicon diaphragm and the PZT layer, as well as the areas of the top two electrodes on the total output charge are studied. The effects of the temperature field are also studied and finally a modal analysis of the accelerometer is performed. The simulation results obtained via finite element modelling has the potential of helping the design of piezoelectric MEMS accelerometers and thus, improve their performances.
AB - In this paper, a two-dimensional finite element model of a piezoelectric MEMS accelerometer is developed and analyzed using FreeFem++. First, a steady state equation of the thermal conduction is solved to obtain the temperature field. Then the quasi-stationary Cauchy-Navier's equations with thermal stresses present are solved to determine the distribution of the total stresses. As a result, the electric displacement along the vertical direction of the PZT piezoelectric layer is calculated using the constitutive equation of the piezoelectric material. Finally, the total output electric charge on the two top electrodes are determined. The influences of thicknesses of the silicon diaphragm and the PZT layer, as well as the areas of the top two electrodes on the total output charge are studied. The effects of the temperature field are also studied and finally a modal analysis of the accelerometer is performed. The simulation results obtained via finite element modelling has the potential of helping the design of piezoelectric MEMS accelerometers and thus, improve their performances.
KW - FreeFem++
KW - MEMS piezoelectric accelerometer
KW - Modal analysis
KW - Thermal stresses
UR - https://www.scopus.com/pages/publications/85093362823
U2 - 10.1109/ICEPT50128.2020.9202956
DO - 10.1109/ICEPT50128.2020.9202956
M3 - 会议稿件
AN - SCOPUS:85093362823
T3 - 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
BT - 2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronic Packaging Technology, ICEPT 2020
Y2 - 12 August 2020 through 15 August 2020
ER -