Skip to main navigation Skip to search Skip to main content

Simulation and Optimization of Inkjet-printed Outlines to Improve Pattern Fidelity

  • Harbin Institute of Technology (Shenzhen)

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Inkjet-printing has become a effective method for fabricating flexible electronics. This paper aims to improve the form fidelity via a numerical method. The properties of ink fluid and parameters of printing process are taken into consideration, and some rules for improve pattern fidelity are found. Finally, strategies are proposed according to the results of simulation.

Original languageEnglish
Title of host publication2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665413916
DOIs
StatePublished - 14 Sep 2021
Externally publishedYes
Event22nd International Conference on Electronic Packaging Technology, ICEPT 2021 - Xiamen, China
Duration: 14 Sep 202117 Sep 2021

Publication series

Name2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021

Conference

Conference22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Country/TerritoryChina
CityXiamen
Period14/09/2117/09/21

Keywords

  • fluid simulation
  • printed electronics
  • selective treatment

Fingerprint

Dive into the research topics of 'Simulation and Optimization of Inkjet-printed Outlines to Improve Pattern Fidelity'. Together they form a unique fingerprint.

Cite this