TY - GEN
T1 - Simulation Analysis of Tin Absorption Morphology of CCGA Solder Columns Based on Energy Minimization
AU - Zhang, Wei
AU - Qu, Chen
AU - Liu, Kunpeng
AU - Xiang, Gang
AU - Hang, Chunjin
AU - Tian, Yanhong
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Tin absorption on the solder column represents a unique phenomenon occurring during the assembly process of CCGA devices. This phenomenon, where solder ascends along the column, diminishes the effective length of the CCGA solder column, thereby significantly impacting the reliability of the solder joints assembled. Two CCGA geometric models were established for 90Pb10Sn column and 80Pb20Sn column with spiral copper, respectively, considering the influence of factors such as solder column structure, solder volume, column wetting angle and pad wetting angle on the solder joint morphology. Based on the principle of energy minimization, the actual solder joint morphology under different factor levels was calculated, providing a reasonable process combination for actual production processes.
AB - Tin absorption on the solder column represents a unique phenomenon occurring during the assembly process of CCGA devices. This phenomenon, where solder ascends along the column, diminishes the effective length of the CCGA solder column, thereby significantly impacting the reliability of the solder joints assembled. Two CCGA geometric models were established for 90Pb10Sn column and 80Pb20Sn column with spiral copper, respectively, considering the influence of factors such as solder column structure, solder volume, column wetting angle and pad wetting angle on the solder joint morphology. Based on the principle of energy minimization, the actual solder joint morphology under different factor levels was calculated, providing a reasonable process combination for actual production processes.
KW - CCGA
KW - solder joint morphology
KW - tin absorption
UR - https://www.scopus.com/pages/publications/85206102081
U2 - 10.1109/ICEPT63120.2024.10668514
DO - 10.1109/ICEPT63120.2024.10668514
M3 - 会议稿件
AN - SCOPUS:85206102081
T3 - 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
BT - 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th International Conference on Electronic Packaging Technology, ICEPT 2024
Y2 - 7 August 2024 through 9 August 2024
ER -