@inproceedings{907a0d4d0fe348c898378cd776f6a2ba,
title = "Shear Properties and Fracture Behaviors of Cu/Sn-37Pb/Cu Solder Interconnections at Cryogenic Temperatures",
abstract = "The shear properties and fracture behavior of the Cu/Sn-37Pb/Cu solder interconnections at temperatures ranging from -196 °C to room temperature were investigated in the present study. With a decrement in the testing temperature, the shear strength of the solder interconnections gradually increased first, but then decreased after it reached a maximum value at -150 °C. The shear strength of Cu/Sn-37Pb/Cu interconnects at cryogenic temperatures (below -55 °C) was much higher than that at room temperature. With a decline in the testing temperature, the fracture position of the solder interconnections transformed from in the solder bulk to partially in the solder bulk and partially in the interfacial IMCs.",
keywords = "cryogenic temperature, fracture behavior, shear property, solder interconnection",
author = "Ruyu Tian and Chunlei Wang and Yanhong Tian",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 22nd International Conference on Electronic Packaging Technology, ICEPT 2021 ; Conference date: 14-09-2021 Through 17-09-2021",
year = "2021",
month = sep,
day = "14",
doi = "10.1109/ICEPT52650.2021.9567981",
language = "英语",
series = "2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021",
address = "美国",
}