@inproceedings{1bab58a0131a40bba6e121c7ec4bc9e4,
title = "Self-sensed inspection of joint temperature for thin-film sensors",
abstract = "This paper presents a new method named self-sensed inspection of joint temperature to measure the temperature during bonding process and assess joint quality for thin-film sensor. The thermoelectric force of interfaces was measured The top temperature was calculated during the bonding process through temperature calibration. Inspecting the top thermoelectric force monitored the joint quality. The method was examined successfully by bonding strength experiment and appearance of joints. Except for parallel gap bonding, it can also be used in other micro-joining methods.",
keywords = "Bonding processes, Calibration, Force measurement, Force sensors, Inspection, Temperature measurement, Temperature sensors, Thermal force, Thermoelectricity, Thin film sensors",
author = "Chenxi Wang and Chunqing Wang",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th International Conference on Electronic Packaging Technology, ICEPT 2003 ; Conference date: 28-10-2003 Through 30-10-2003",
year = "2003",
doi = "10.1109/EPTC.2003.1298773",
language = "英语",
series = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "422--426",
editor = "Keyun Bi and Barnwell, \{Peter G.\} and Jiaji Wang",
booktitle = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
address = "美国",
}