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Room-temperature direct bonding of ZrO2 ceramic and SiCP/Al composite using ultrasonic waves

  • H. J. Dong
  • , S. J. Wei
  • , Z. L. Li*
  • , X. G. Song*
  • , W. X. He
  • , J. C. Feng
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Harbin Institute of Technology Weihai

Research output: Contribution to journalArticlepeer-review

Abstract

Direct bonding of ZrO2 ceramic and SiCP/2A14 composite was successfully achieved in only a few seconds using ultrasonic waves at room temperature. A continuous void-free amorphous Al2O3 interphase layer with an average thickness ranging from 60 to 70 nm was verified to be formed between ZrO2 ceramic and SiCP/2A14 composite, which could be attributed to the significantly enhanced diffusion of O and Al atoms around the bonding interface due to a remarkable increase in defect density caused by the physical effects of ultrasonic vibration. The maximum average shear strength of the ZrO2–SiCP/2A14 joints was approximately 36.48 MPa.

Original languageEnglish
Pages (from-to)431-436
Number of pages6
JournalCeramics International
Volume49
Issue number1
DOIs
StatePublished - 1 Jan 2023

Keywords

  • Amorphous AlO layer
  • Interface
  • Room-temperature direct bonding
  • Ultrasonic waves
  • ZrO-SiC/Al joint

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