Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink

Yanjie Liu; Jiang Wu; Haijun Han; Tao Liu

doi:10.1109/ICMA.2014.6885716

Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink

Yanjie Liu
, Jiang Wu
, Haijun Han
, Tao Liu

School of Mechatronics Engineering

Harbin Institute of Technology
Kochi University of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

In order to achieve the function of measuring friction on contacting surface between wafer and manipulator in real time, in this paper, we mainly measured the resolution and precision of the three dimension force sensor based on piezoresistive conductive ink. Resolution of tangential force improves with preload in normal direction increasing and the maximum resolution is less than 0.025 N with 0.8 N preload. Maximum error is about 30.62% because of low tangential stiffness of elastomer. The experiment results indicate that this sensor has characteristics of small volume, high flexibility and high resolution, which is prospective for using in wafer transfer system with improvement of higher precision in the future.

Original language	English
Title of host publication	2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
Publisher	IEEE Computer Society
Pages	321-325
Number of pages	5
ISBN (Print)	9781479939787
DOIs	https://doi.org/10.1109/ICMA.2014.6885716
State	Published - 2014
Event	11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014 - Tianjin, China Duration: 3 Aug 2014 → 6 Aug 2014

Publication series

Name	2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014

Conference

Conference	11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
Country/Territory	China
City	Tianjin
Period	3/08/14 → 6/08/14

Keywords

Flexible three dimension force sensor
Resolution measurement

Access to Document

10.1109/ICMA.2014.6885716

Cite this

Liu, Y., Wu, J., Han, H., & Liu, T. (2014). Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink. In 2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014 (pp. 321-325). Article 68856716 (2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014). IEEE Computer Society. https://doi.org/10.1109/ICMA.2014.6885716

@inproceedings{f26c887c527f439daaf8319952be4edd,

title = "Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink",

abstract = "In order to achieve the function of measuring friction on contacting surface between wafer and manipulator in real time, in this paper, we mainly measured the resolution and precision of the three dimension force sensor based on piezoresistive conductive ink. Resolution of tangential force improves with preload in normal direction increasing and the maximum resolution is less than 0.025 N with 0.8 N preload. Maximum error is about 30.62\% because of low tangential stiffness of elastomer. The experiment results indicate that this sensor has characteristics of small volume, high flexibility and high resolution, which is prospective for using in wafer transfer system with improvement of higher precision in the future.",

keywords = "Flexible three dimension force sensor, Resolution measurement",

author = "Yanjie Liu and Jiang Wu and Haijun Han and Tao Liu",

year = "2014",

doi = "10.1109/ICMA.2014.6885716",

language = "英语",

isbn = "9781479939787",

series = "2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014",

publisher = "IEEE Computer Society",

pages = "321--325",

booktitle = "2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014",

address = "美国",

note = "11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014 ; Conference date: 03-08-2014 Through 06-08-2014",

}

Liu, Y, Wu, J, Han, H & Liu, T 2014, Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink. in 2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014., 68856716, 2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014, IEEE Computer Society, pp. 321-325, 11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014, Tianjin, China, 3/08/14. https://doi.org/10.1109/ICMA.2014.6885716

Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink. / Liu, Yanjie; Wu, Jiang; Han, Haijun et al.
2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014. IEEE Computer Society, 2014. p. 321-325 68856716 (2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink

AU - Liu, Yanjie

AU - Wu, Jiang

AU - Han, Haijun

AU - Liu, Tao

PY - 2014

Y1 - 2014

N2 - In order to achieve the function of measuring friction on contacting surface between wafer and manipulator in real time, in this paper, we mainly measured the resolution and precision of the three dimension force sensor based on piezoresistive conductive ink. Resolution of tangential force improves with preload in normal direction increasing and the maximum resolution is less than 0.025 N with 0.8 N preload. Maximum error is about 30.62% because of low tangential stiffness of elastomer. The experiment results indicate that this sensor has characteristics of small volume, high flexibility and high resolution, which is prospective for using in wafer transfer system with improvement of higher precision in the future.

AB - In order to achieve the function of measuring friction on contacting surface between wafer and manipulator in real time, in this paper, we mainly measured the resolution and precision of the three dimension force sensor based on piezoresistive conductive ink. Resolution of tangential force improves with preload in normal direction increasing and the maximum resolution is less than 0.025 N with 0.8 N preload. Maximum error is about 30.62% because of low tangential stiffness of elastomer. The experiment results indicate that this sensor has characteristics of small volume, high flexibility and high resolution, which is prospective for using in wafer transfer system with improvement of higher precision in the future.

KW - Flexible three dimension force sensor

KW - Resolution measurement

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DO - 10.1109/ICMA.2014.6885716

M3 - 会议稿件

AN - SCOPUS:84906987636

SN - 9781479939787

T3 - 2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014

SP - 321

EP - 325

BT - 2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014

PB - IEEE Computer Society

T2 - 11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014

Y2 - 3 August 2014 through 6 August 2014

ER -

Liu Y, Wu J, Han H, Liu T. Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink. In 2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014. IEEE Computer Society. 2014. p. 321-325. 68856716. (2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014). doi: 10.1109/ICMA.2014.6885716

Resolution and precision measurement of a three dimension force sensor based on piezoresistive conductive ink

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