Resist shaping for replication of micro-optical elements with continuous relief in fused silica

To improve the replicating quality in producing micro-optical elements with continuous relief, the resist layer on substrate is shaped against the negative stamp by dry etching to enable it to have the same geometry as the pattern area of the negative stamp. The negative stamp is then aligned with and imprinted into the shaped resist. The produced continuous relief is transferred into the substrate by dry etching as well. Experiment results indicate that this method has both the long service life of a negative stamp and easy filling of a positive stamp.