@inproceedings{b0d25d4ef3034174ad27e87f75eb4135,
title = "Residual stresses around femtosecond laser ablated grooves in silicon wafer evaluated by nanoindentation",
abstract = "As an excellent micromachining method, femtosecond laser ablation is more and more frequently used in micromachining. Femtosecond laser ablation can take residual stresses beside the machining area, which may affect the performance of micro devices. In this paper, grooves were ablated by femtosecond laser and nanoindentation experiments were exploited to uncover residual stresses in the area beside the grooves. The reduced modulus and hardness in different areas around the groove were measured through nanoindention and position dependent regular changes in reduced modulus were found. Such changes contained the information of residual stresses in such area. A formula correlating residual stresses with the reduced modulus was set up.",
keywords = "Ablation, Femtosecond laser, Nanoindentation, Residual stress, Single-crystalline silicon",
author = "Yongzhi Cao and Yanshen Wang and Shen Dong and Yanqiang Yang and Yingchun Liang and Tao Sun",
year = "2007",
doi = "10.1117/12.782835",
language = "英语",
isbn = "9780819468819",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies",
note = "3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies, AOMATT 2007: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems ; Conference date: 08-07-2007 Through 12-07-2007",
}