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Research on the method of detecting ultrasonic bonding fault

  • Yuanxun Zheng
  • , Zhili Long
  • , Chunfeng Li
  • , Jianguo Zhang
  • , Zhiyong Pan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper proposes a kind of way to detect ultrasonic bonding without wire according to the method existed. Collect the electrical signal of the ultrasonic transducer through the chip named STM32 without using other sensor. Through the statistical method, it builds the model of the noise according to the detection system. It proposes a method which is basing on Kalman filter to find out the threshold of the feature, which is in order to improve the adaptability of system. Finally, it prove the feasibility of this method through a large number of experiments.

Original languageEnglish
Title of host publication2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
PublisherIEEE Computer Society
Pages1399-1404
Number of pages6
ISBN (Print)9781479939787
DOIs
StatePublished - 2014
Externally publishedYes
Event11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014 - Tianjin, China
Duration: 3 Aug 20146 Aug 2014

Publication series

Name2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014

Conference

Conference11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
Country/TerritoryChina
CityTianjin
Period3/08/146/08/14

Keywords

  • thread break detection
  • ultrasonic bonding
  • ultrasonic power

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