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Research on simulation and experiment of the electromagnetically induced acoustic emission based on high-current loading

  • Chuang Zhang*
  • , Suzhen Liu
  • , Qingxin Yang
  • , Liang Jin
  • *Corresponding author for this work
  • Hebei University of Technology
  • Tiangong University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Electromagnetically induced acoustic emission (EMAE) technique is a new nondestructive testing (NDT). It did nondestructive detection with the effect of dynamic electromagnetic loading to generate a stress field stimulating stress waves from the defects. The principle and implementation procedure of the EMAE is deeply analyzed in this paper. The finite element model of EMAE has been implemented based on the concrete experiment models. The sample's deformation has been analyzed with the different loading current and external magnetic field. The experiment of defect detection is achieved. The pulse-current loading unit is designed and applied in the detection experiment of Aluminum crack. It analyses the influence of loading conditions and specimen type on the EMAE signal in detail. At last, it verifies that it could excite the phenomenon of EMAE in the metal plate with the crack by means of time-frequency analysis to the experimental signals.

Original languageEnglish
Title of host publication2012 6th International Conference on Electromagnetic Field Problems and Applications, ICEF'2012
DOIs
StatePublished - 2012
Externally publishedYes
Event2012 6th International Conference on Electromagnetic Field Problems and Applications, ICEF'2012 - Dalian, China
Duration: 19 Jun 201221 Jun 2012

Publication series

Name2012 6th International Conference on Electromagnetic Field Problems and Applications, ICEF'2012

Conference

Conference2012 6th International Conference on Electromagnetic Field Problems and Applications, ICEF'2012
Country/TerritoryChina
CityDalian
Period19/06/1221/06/12

Keywords

  • electromagnetically induced acoustic emission
  • feature extracting
  • metal crack detection
  • signal processing

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