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Research on nano-cutting processes based on parallel molecular dynamics

  • Yingchun Liang*
  • , Degang Li
  • , Qingshun Bai
  • , Yulan Tang
  • *Corresponding author for this work
  • School of Mechatronics Engineering, Harbin Institute of Technology
  • Shenyang Jianzhu University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

To investigate the effect of tool geometry on single-crystal silicon nano-cutting, parallel molecular dynamics (MD) simulations are carried out with different tool rake angles. In this study, a parallel arithmetic based on mechanism of spatial decomposition together with MD is applied to simulate nano-cutting processes of single-crystal silicon (100) plane by using a single-crystal diamond tool. The simulation results show that tool rake angle has great effects on cutting forces and subsurface stress, and the effect of tool rake angle variation on work-piece potential energy is not evident while cutting single-crystal Silicon (100) plane. Moreover, the analysis of cutting forces and potential energy show that there is not evident dislocation in the nano-cutting.

Original languageEnglish
Title of host publicationAdvances in Materials Manufacturing Science and Technology II - Selected Papers from the 12th International Manufacturing Conference in China
EditorsChengyu Jiang, Geng Liu, Dinghua Zhang, Xipeng Xu
PublisherTrans Tech Publications Ltd
Pages357-360
Number of pages4
ISBN (Print)0878494219, 9780878494217
DOIs
StatePublished - 2006
Externally publishedYes
Event12th International Manufacturing Conference in China, IMCC2006 - Xi'an, China
Duration: 21 Sep 200623 Sep 2006

Publication series

NameMaterials Science Forum
Volume532-533
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference12th International Manufacturing Conference in China, IMCC2006
Country/TerritoryChina
CityXi'an
Period21/09/0623/09/06

Keywords

  • Molecular dynamics
  • Nano-cutting
  • Parallel calculation
  • Simulation

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