Research on Multi-Chip Modules Device Junction Temperature Prediction Method

As the package size of Multi-Chip Modules continues to decrease and power density continues to increase, the junction temperature of the chip rises sharply. Accurately predicting the junction temperature of chips during service is of great significance in order to meet the requirements of chip heat dissipation and reliability. After fully considering the thermal coupling effect, this paper uses a thermal resistance network model, thermal simulation, and thermal resistance matrix to calculate the junction temperature of a Multi-Chip Modules device. Meanwhile, the results mentioned above were verified by the measured results. The results indicate that the relative error between the calculated and measured results obtained by the three methods is less than 10 %. The results indicate that all three methods can efficiently and accurately predict the junction temperature of Multi-Chip Modules devices. In addition, the prediction accuracy of the three methods, in descending order, is thermal resistance matrix, thermal simulation, and thermal resistance network model.