Research on Grinding Parameter Optimization Method Considering Sapphire Grinding Quality

Monocrystal sapphire is extensively utilized in various fields, including satellite space technology, high-power lasers, and semiconductor substrates. However, the exceptional hardness and brittleness of sapphire present significant challenges during the grinding process. A reasonable adjustment of process parameters serves as an effective approach to ensure the high-quality, high-efficiency, and cost-effective manufacturing of sapphire components. To address these challenges, this paper proposes a multi-objective optimization strategy for the process parameters in sapphire ultra-precision grinding. Initially, an L₉3⁴ orthogonal experiment for sapphire grinding was designed using the Taguchi method. Concurrently, factors such as surface morphology, surface roughness, surface uniformity, grinding force, and subsurface damage depth were identified as optimization targets. Subsequently, Grey Relational Analysis (GRA) was conducted to determine the optimal grinding parameters that enhance grinding quality. The proposed strategy was experimentally validated through practical experiments. The results indicate that the optimization strategy can significantly improve the processing quality of sapphire during the grinding process.