TY - GEN
T1 - Research on anodic bonding process simulation tool
AU - Jialu, Tang
AU - Xiaowei, Liu
AU - He, Zhang
AU - Xianhui, Shao
AU - Haifeng, Zhang
PY - 2011
Y1 - 2011
N2 - Based on a brand-new anodic bonding process model, one anodic bonding simulation tool has been established which realizes process and result visualization simulation under different temperature and voltage. The IP library was established by three basic characteristics, anodic bonding process features, commercial anodic bonding equipment and process parameters, and the process simulation module, visual simulation module and data access module of this software was written by c plus plus language. This simulation tool break through mathematical description of anodic bonding process behavior, and complete some key technologies such as extraction of parameters, prove of experimentation test, visualization of anodic bonding process and setting of IP library, besides it achieves description of parameters and simulation of anodic bonding behavior.
AB - Based on a brand-new anodic bonding process model, one anodic bonding simulation tool has been established which realizes process and result visualization simulation under different temperature and voltage. The IP library was established by three basic characteristics, anodic bonding process features, commercial anodic bonding equipment and process parameters, and the process simulation module, visual simulation module and data access module of this software was written by c plus plus language. This simulation tool break through mathematical description of anodic bonding process behavior, and complete some key technologies such as extraction of parameters, prove of experimentation test, visualization of anodic bonding process and setting of IP library, besides it achieves description of parameters and simulation of anodic bonding behavior.
KW - Anodic Bonding
KW - Bonding simulation
KW - MEMS CAD
UR - https://www.scopus.com/pages/publications/84858739408
U2 - 10.1109/AISMOT.2011.6159377
DO - 10.1109/AISMOT.2011.6159377
M3 - 会议稿件
AN - SCOPUS:84858739408
SN - 9781457707964
T3 - 2011 Academic International Symposium on Optoelectronics and Microelectronics Technology, AISOMT 2011
SP - 297
EP - 300
BT - 2011 Academic International Symposium on Optoelectronics and Microelectronics Technology, AISOMT 2011
T2 - 2011 Academic International Symposium on Optoelectronics and Microelectronics Technology, AISOMT 2011
Y2 - 12 October 2011 through 16 October 2011
ER -