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Research of single-event burnout and hardening of AlGaN/GaN-Based MISFET

  • Xin Luo
  • , Ying Wang*
  • , Yue Hao
  • , Xing Ji Li
  • , Chao Ming Liu
  • , Xin Xing Fei
  • , Cheng Hao Yu
  • , Fei Cao
  • *Corresponding author for this work
  • Hangzhou Dianzi University
  • Xidian University

Research output: Contribution to journalArticlepeer-review

Abstract

This brief first time presents single-event burnout (SEB) simulation results for conventional AlGaN/ GaN gate field plate MISFET (GFP-C MISFET), simultaneously, a hardened MISFET with electrode connected doped plugs in the buffer (EC-DP MISFET) is proposed for the first time. The SEB triggering mechanisms contain the back-channel effect and following impact ionization dominated by electron in the high field region. By comparing the simulation results from the GFP-C MISFET and proposed hardened EC-DP MISFET, the carriers induced by heavy ion can be quickly absorbed to drain and source electrode through EC-DP, so that the proposed EC-DP MISFET can achieve better SEB performance than conventional one. With a heavy ion having the linear energy transfer value of 0.6-pC/μm striking vertically, SEB threshold voltage obtained in GFP-C MISFET and hardened EC-DP MISFET is 280 and 338 V, respectively.

Original languageEnglish
Article number8599119
Pages (from-to)1118-1122
Number of pages5
JournalIEEE Transactions on Electron Devices
Volume66
Issue number2
DOIs
StatePublished - Feb 2019

Keywords

  • Electrode connected doped plugs (EC-DP)
  • MISFET
  • SEB
  • single-event burnout (SEB) hardening
  • technology computer-aided design (TCAD)

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