Abstract
This brief first time presents single-event burnout (SEB) simulation results for conventional AlGaN/ GaN gate field plate MISFET (GFP-C MISFET), simultaneously, a hardened MISFET with electrode connected doped plugs in the buffer (EC-DP MISFET) is proposed for the first time. The SEB triggering mechanisms contain the back-channel effect and following impact ionization dominated by electron in the high field region. By comparing the simulation results from the GFP-C MISFET and proposed hardened EC-DP MISFET, the carriers induced by heavy ion can be quickly absorbed to drain and source electrode through EC-DP, so that the proposed EC-DP MISFET can achieve better SEB performance than conventional one. With a heavy ion having the linear energy transfer value of 0.6-pC/μm striking vertically, SEB threshold voltage obtained in GFP-C MISFET and hardened EC-DP MISFET is 280 and 338 V, respectively.
| Original language | English |
|---|---|
| Article number | 8599119 |
| Pages (from-to) | 1118-1122 |
| Number of pages | 5 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 66 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 2019 |
Keywords
- Electrode connected doped plugs (EC-DP)
- MISFET
- SEB
- single-event burnout (SEB) hardening
- technology computer-aided design (TCAD)
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