TY - GEN
T1 - Reliability study on thermal cycling of QFP device solder joints based on morphological optimisation
AU - Liu, Kunpeng
AU - Zhang, Wei
AU - Qu, Chen
AU - Xiang, Gang
AU - Wang, Shang
AU - Tian, Yanhong
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - As a research method with low cost and high accuracy, finite element simulation is widely used in various fields. However, there are still some difficulties in obtaining accurate initial model in some researches. In this paper, Surface Evolver software is used to calculate the initial solder joint model of QFP device by energy minimization principle, and the model is tested experimentally. Then, the solder joint model was imported into the finite element software to establish the QFP device model, and the thermal cycle simulation test at -55-150°C was carried out to obtain the mechanical properties of the solder joint. Finally, the fatigue life prediction model is used to calculate the life of solder joints.
AB - As a research method with low cost and high accuracy, finite element simulation is widely used in various fields. However, there are still some difficulties in obtaining accurate initial model in some researches. In this paper, Surface Evolver software is used to calculate the initial solder joint model of QFP device by energy minimization principle, and the model is tested experimentally. Then, the solder joint model was imported into the finite element software to establish the QFP device model, and the thermal cycle simulation test at -55-150°C was carried out to obtain the mechanical properties of the solder joint. Finally, the fatigue life prediction model is used to calculate the life of solder joints.
KW - fatigue life
KW - finite element simulation
KW - solder joint
KW - surface evolver
UR - https://www.scopus.com/pages/publications/85206094090
U2 - 10.1109/ICEPT63120.2024.10668678
DO - 10.1109/ICEPT63120.2024.10668678
M3 - 会议稿件
AN - SCOPUS:85206094090
T3 - 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
BT - 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th International Conference on Electronic Packaging Technology, ICEPT 2024
Y2 - 7 August 2024 through 9 August 2024
ER -