TY - GEN
T1 - Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads
AU - Zhang, Shuye
AU - Xu, Jianhao
AU - Zhang, Shang
AU - He, Peng
AU - Sun, Mingjia
AU - Yang, Jianqun
AU - Li, Xingji
AU - Paik, Kyung Wook
N1 - Publisher Copyright:
© 2021 IEEE
PY - 2021
Y1 - 2021
N2 - In this paper, reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads was investigated. COMSOL Multiphysics, a finite element software, was used to analyze the mechanical behavior of our device under a -55ć/125ć thermal cycling and 1500G@1ms with half-sine pulse impact coupled load. MEMS chip was bonded on a silicon interposer by solder balls. An application specific integrated circuit (ASIC) for the signal processing was placed on the interposer beneath the MEMS. Combining the effects of thermal stress and impact loads, we hope to find out the failure modes of interconnect structures including solder joints and whole device. The deformation and stress distribution of the overall device will be carried out for layout optimization of interconnect structures.
AB - In this paper, reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads was investigated. COMSOL Multiphysics, a finite element software, was used to analyze the mechanical behavior of our device under a -55ć/125ć thermal cycling and 1500G@1ms with half-sine pulse impact coupled load. MEMS chip was bonded on a silicon interposer by solder balls. An application specific integrated circuit (ASIC) for the signal processing was placed on the interposer beneath the MEMS. Combining the effects of thermal stress and impact loads, we hope to find out the failure modes of interconnect structures including solder joints and whole device. The deformation and stress distribution of the overall device will be carried out for layout optimization of interconnect structures.
KW - Finite element method simulation
KW - MEMS
KW - Multi-physics coupling
KW - Reliability simulation
KW - Thermal cycle simulation
UR - https://www.scopus.com/pages/publications/85124661669
U2 - 10.1109/ECTC32696.2021.00221
DO - 10.1109/ECTC32696.2021.00221
M3 - 会议稿件
AN - SCOPUS:85124661669
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1376
EP - 1381
BT - Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 71st IEEE Electronic Components and Technology Conference, ECTC 2021
Y2 - 1 June 2021 through 4 July 2021
ER -