Regularities of low-temperature deformation and fracture of polyimide films of kapton h type of different thickness

The mechanical characteristics (limit of forced elasticity sforc, fracture stress sfr, relative deformation to failure Ɛfr) of polyimide films of kapton H type under uniaxial tension conditions along the direction of drawing in the temperature range (4.2-293 K), deformation rates (10^-5-10^-3 s^-1) and film thicknesses (25, 75 and 125 μm) were investigated. It is discovered, that the forced-elastic state remains for all films up to 4.2 K of all strain rates-sfors<sfr. In this case, the reserve of elasticity significantly depends on the thickness of the film with a decrease in temperature. A sharp decrease in Ɛfr occurs in films: 125 μm thick-at 77 K, 75 μm thick-at 4.2 K. Two variants of deformation curves are possible in a 25 μm thick film at 4.2 K: with a short nonlinear stage or with a long one proceeding jumpily. The working surface of the samples that have undergone jump deformation is covered with a deformation relief, partially representing a delayed highly elastic deformation. The sfors limit is most sensitive to the strain rate. The nature of the strain rate sensitivity sfors(ƐƐ) depends on the temperature and film thickness. The change to the opposite in the character of sfors(ƐƐ) and sfr(ƐƐ) with a decrease in temperature to 4.2 K in 75 and 125 thick films was found for a first time. Change in the character of sfors(ƐƐ) is not observed in 25 μm thick film which retains the maximum reserve of elasticity at 4.2 K.